Product Information

IRF820

IRF820 electronic component of Samsung

Datasheet
Trans MOSFET N-CH 500V 2.5A 3-Pin(3+Tab) TO-220AB

Manufacturer: Samsung
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (AUD)

1: AUD 3.6 ( AUD 3.96 Inc GST) ea
Line Total: AUD 3.6 ( AUD 3.96 Inc GST)

720 - Global Stock
Ships to you between
Mon. 22 Jul to Fri. 26 Jul
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
235 - Global Stock


Ships to you between Mon. 22 Jul to Fri. 26 Jul

MOQ : 14
Multiples : 1

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IRF820
Samsung

14 : AUD 3.4615
25 : AUD 2.9615
100 : AUD 1.6692
250 : AUD 0.8288
500 : AUD 0.7769

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs - Gate-Source Breakdown Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Channel Mode
Configuration
Series
Brand
Fall Time
Rise Time
Factory Pack Quantity :
Typical Turn-Off Delay Time
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IRF820, SiHF820 Vishay Siliconix Power MOSFET FEATURES PRODUCT SUMMARY Dynamic dV/dt Rating V (V) 500 DS Available Repetitive Avalanche Rated R ( )V = 10 V 3.0 DS(on) GS RoHS* Fast Switching Q (Max.) (nC) 24 g COMPLIANT Ease of Paralleling Q (nC) 3.3 gs Q (nC) 13 Simple Drive Requirements gd Configuration Single Compliant to RoHS Directive 2002/95/EC DESCRIPTION D Third generation Power MOSFETs from Vishay provide the TO-220AB designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. G The TO-220AB package is universally preferred for commercial-industrial applications at power dissipation S levels to approximately 50 W. The low thermal resistance D and low package cost of the TO-220AB contribute to its G S wide acceptance throughout the industry. N-Channel MOSFET ORDERING INFORMATION Package TO-220AB IRF820PbF Lead (Pb)-free SiHF820-E3 IRF820 SnPb SiHF820 ABSOLUTE MAXIMUM RATINGS (T = 25 C, unless otherwise noted) C PARAMETER SYMBOLLIMITUNIT Drain-Source Voltage V 500 DS V Gate-Source Voltage V 20 GS T = 25 C 2.5 C Continuous Drain Current V at 10 V I GS D T = 100 C 1.6 A C a Pulsed Drain Current I 8.0 DM Linear Derating Factor 0.40 W/C b Single Pulse Avalanche Energy E 210 mJ AS a Repetitive Avalanche Current I 2.5 A AR a Repetitive Avalanche Energy E 5.0 mJ AR Maximum Power Dissipation T = 25 C P 50 W C D c Peak Diode Recovery dV/dt dV/dt 3.5 V/ns Operating Junction and Storage Temperature Range T , T - 55 to + 150 J stg C d Soldering Recommendations (Peak Temperature) for 10 s 300 10 lbf in Mounting Torque 6-32 or M3 screw 1.1 N m Notes a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11). b. V = 50 V, starting T = 25 C, L = 60 mH, R = 25 , I = 2.5 A (see fig. 12). DD J g AS c. I 2.5 A, dI/dt 50 A/s, V V , T 150 C. SD DD DS J d. 1.6 mm from case. * Pb containing terminations are not RoHS compliant, exemptions may apply Document Number: 91059 www.vishay.com S11-0507-Rev. C, 21-Mar-11 1 This datasheet is subject to change without notice. THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 IRF820, SiHF820 Vishay Siliconix THERMAL RESISTANCE RATINGS PARAMETER SYMBOLTYP. MAX. UNIT Maximum Junction-to-Ambient R -62 thJA Case-to-Sink, Flat, Greased Surface R 0.50 - C/W thCS Maximum Junction-to-Case (Drain) R -2.5 thJC SPECIFICATIONS (T = 25 C, unless otherwise noted) J PARAMETER SYMBOLTEST CONDITIONS MIN.TYP.MAX.UNIT Static Drain-Source Breakdown Voltage V V = 0 V, I = 250 A 500 - - V DS GS D V Temperature Coefficient V /T Reference to 25 C, I = 1 mA - 0.59 - V/C DS DS J D Gate-Source Threshold Voltage V V = V , I = 250 A 2.0 - 4.0 V GS(th) DS GS D Gate-Source Leakage I V = 20 V - - 100 nA GSS GS V = 500 V, V = 0 V - - 25 DS GS Zero Gate Voltage Drain Current I A DSS V = 400 V, V = 0 V, T = 125 C - - 250 DS GS J b Drain-Source On-State Resistance R V = 10 V I = 1.5 A -- 3.0 DS(on) GS D Forward Transconductance g V = 50 V, I = 1.5 A 1.5 - - S fs DS D Dynamic Input Capacitance C - 360 - iss V = 0 V, GS Output Capacitance C -9V = 25 V, 2- pF oss DS f = 1.0 MHz, see fig. 5 Reverse Transfer Capacitance C -37- rss Total Gate Charge Q -- 24 g I = 2.1 A, V = 400 V, D DS Gate-Source Charge Q --V = 10 V 3.3 nC gs GS b see fig. 6 and 13 Gate-Drain Charge Q --13 gd Turn-On Delay Time t -8.0 - d(on) Rise Time t -8.6 - r V = 250 V, I = 2.1 A, DD D ns b R = 18 , R = 100 , see fig. 10 g D Turn-Off Delay Time t -33- d(off) Fall Time t -16- f D Between lead, Internal Drain Inductance L -4.5 - D 6 mm (0.25") from nH package and center of G die contact Internal Source Inductance L -7.5 - S S Drain-Source Body Diode Characteristics MOSFET symbol D Continuous Source-Drain Diode Current I -- 2.5 S showing the A integral reverse G a Pulsed Diode Forward Current I p - n junction diode -- 8.0 SM S b Body Diode Voltage V T = 25 C, I = 2.5 A, V = 0 V -- 1.6 V SD J S GS Body Diode Reverse Recovery Time t - 260 520 ns rr T = 25 C, I = 2.1 A, dI/dt = 100 A/s J F Body Diode Reverse Recovery Charge Q -0.7 1.4 nC rr Forward Turn-On Time t Intrinsic turn-on time is negligible (turn-on is dominated by L and L ) on S D Notes a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11). b. Pulse width 300 s; duty cycle 2 %. www.vishay.com Document Number: 91059 2 S11-0507-Rev. C, 21-Mar-11 This datasheet is subject to change without notice. THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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