Spezifikation fr Freigabe / specification for release Kunde / customer : Artikelnummer / part number : 823 06 120 029 Datum / Date : 2013-01-16 Bezeichnung : description : 0603 ESD Suppressor WE-VEUL SMD size: 0603 ROHS Compliant A Mechanische Abmessungen / dimensions : SIZE (Unit : mm) SISE W L T a 0402 0.5 1.0 0.38 0.25 0603 0.8 1.6 0.5 0.3 B Elektrische Eigenschaften / electrical properties : TECHNICAL DATA Working Max. Clamping Trigger Leakage ESD Pulse ESD Voltage Part Number Capacitance Withstand Voltage Voltage Voltage Current air discharge DC V (*1) V A (*2) kV (*3) pF (*4) 82306120029 12 30 typ. 150 0.01 >100 +/-15 0.2 * 1 Max. Clamping Voltage is measured 30ns after ignition of EN61000-4-2 pulse contact discharge mode * 2 Leakage Current at max working voltage. For 0.05pf types the leakage current is measured at 6 VDC. Capacitance measured at: 1MHz * 3. ESD Typ. Withstands Voltage design and method guarantee this property * 4. Tolerance of capacitance is 0.05pF for 0.05pF types Design and Specifications are subject to change without notice REFERENCE DATA Response time T < 1 ns rise -40+85 Operating ambientg temperature Storage temperature -50+125 Max. temperature solder 260/10s OTHER DATA Body Ceramic End termination Ag/Ni/Sn Packaging Reel Complies with Standard IEC61000-4-2 Marking None Wrth Elektronik eiSos GmbH & Co.KG - Radialex department D-74638 Waldenburg Max-Eyth-Strae 1 - 3 Germany Telefon (+49) (0) 7942 - 945 - 0 Telefax (+49) (0) 7942 - 945 - 400 Spezifikation fr Freigabe / specification for release Kunde / customer : Artikelnummer / part number : 823 06 120 029 Bezeichnung : description : 0603 ESD Suppressor WE-VEUL SMD size: 0603 C Ltpad / soldering spec. : RECOMMENDED SOLDER PAD LAYOUT (Unit : mm) SISE A B C D 0.4~0.6 1.0~1.8 0.6~0.7 0.6~1.2 402 603 0.8~1.2 1.7~3.0 1.2~1.6 0.9~1.8 805 1.0~1.5 2.1~3.8 1.5~2.1 1.1~2.3 1206 1.8~2.5 3.0~5.8 1.8~2.6 1.2~3.3 1210 1.8~2.5 3.2~6.1 2.8~3.8 1.3~3.5 1812 2.5~3.5 4.0~7.3 3.3~4.5 1.5~3.8 2220 3.5~4.6 5.0~8.5 5.2~6.2 1.5~3.9 3220 5.2~6.4 9.5~10.8 5.6~6.0 2.0~2.8 1 - The solder paste shall be printed in a thickness of 150 to 200m. 2 - The SIR test of the solder paste shall be doneBased on JIS-Z-3284 3 - IR reflow Pb Free Process suggestin profile (Based on J-STD-020-C): Rapid heating, partial heating or rapid cooling will easily cause defect of the component. So preheating and gradual cooling process is suggested. IR soldering has the highest yields due to controlled heating rates and solder liquidus times. Make sure that the element is not subjected to a thermal gradient steeper than 3 degrees per second. 2 degrees per second is the ideal gradient. During the soldering process, pre- heating to within 175 degrees of the solders peak temperature is essential to minimize thermal shock. 4 - Soldering recommend paste is Sn 96.5/Ag 3.5 - Preheat 1.The temperature rising speed is suggested to be 2~3/s. 2.Appropriate preheat time will be from 60 to 120 seconds. 3.Temp. maintain at 175 +/-25C 120 seconds. - Heating 1.Careful about sudden rise in temperature as it may worsen the solder ability. 2.Set the peak temperature in 23510-20s or 260C 3-10s. - Cooling 1.Ramp down rate 6C/s max. Perform adequate test in advance as the reflow temperature profile will vary according to the conditions of the manufacturing process, and the specification of the reflow furnace Wrth Elektronik eiSos GmbH & Co.KG - Radialex department D-74638 Waldenburg Max-Eyth-Strae 1 - 3 Germany Telefon (+49) (0) 7942 - 945 - 0 Telefax (+49) (0) 7942 - 945 - 400