Product Information

W25X40CLSNIG

W25X40CLSNIG electronic component of Winbond

Datasheet
NOR Flash Serial-SPI 2.5V/3.3V 4M-bit 512K x 8 8ns 8-Pin SOIC

Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (AUD)

5: AUD 0.5111 ( AUD 0.56 Inc GST) ea
Line Total: AUD 2.5555 ( AUD 2.81 Inc GST)

3635 - Global Stock
Ships to you between
Thu. 18 Jul to Tue. 23 Jul
MOQ: 5  Multiples: 5
Pack Size: 5
Availability Price Quantity
3458 - Global Stock


Ships to you between Thu. 11 Jul to Wed. 17 Jul

MOQ : 1
Multiples : 1

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W25X40CLSNIG
Winbond

1 : AUD 0.5766
10 : AUD 0.515
25 : AUD 0.5096
50 : AUD 0.5044
100 : AUD 0.437
300 : AUD 0.4326
500 : AUD 0.4304

7950 - Global Stock


Ships to you between
Thu. 18 Jul to Tue. 23 Jul

MOQ : 5
Multiples : 5

Stock Image

W25X40CLSNIG
Winbond

5 : AUD 0.4656
50 : AUD 0.3759
150 : AUD 0.351
500 : AUD 0.313
2500 : AUD 0.2997
5000 : AUD 0.2908

3635 - Global Stock


Ships to you between
Thu. 18 Jul to Tue. 23 Jul

MOQ : 5
Multiples : 5

Stock Image

W25X40CLSNIG
Winbond

5 : AUD 0.5111
50 : AUD 0.4085
150 : AUD 0.3572
500 : AUD 0.3188
2500 : AUD 0.2881
5000 : AUD 0.2727

167478 - Global Stock


Ships to you between Wed. 17 Jul to Fri. 19 Jul

MOQ : 1
Multiples : 1

Stock Image

W25X40CLSNIG
Winbond

1 : AUD 0.4688
10 : AUD 0.4299
100 : AUD 0.4034
500 : AUD 0.3981
25000 : AUD 0.3963
50000 : AUD 0.3945

     
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W25X40CL 2.5/3/3.3 V 4M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI Publication Release Date: March 25, 2014 - 1 - Revision F W25X40CL Table of Contents 1. GENERAL DESCRIPTION ......................................................................................................... 4 2. FEATURES ................................................................................................................................. 4 3. PIN CONFIGURATION SOIC 208-MIL, SOIC 150-MIL AND VSOP 150-MIL ............................ 5 4. PAD CONFIGURATION WSON 6X5-MM AND USON 2X3-MM ................................................ 5 5. PIN CONFIGURATION PDIP 300-MIL ....................................................................................... 6 6. PIN DESCRIPTION SOIC, VSOP, WSON, USON AND PDIP ................................................... 6 6.1 Package Types ............................................................................................................... 7 6.2 Chip Select (/CS) ............................................................................................................ 7 6.3 Serial Data Input, Output and IOs (DI, DO, IO0 and IO1) .............................................. 7 6.4 Write Protect (/WP) ......................................................................................................... 7 6.5 HOLD (/HOLD) ................................................................................................................ 7 6.6 Serial Clock (CLK) .......................................................................................................... 7 7. BLOCK DIAGRAM ...................................................................................................................... 8 7.1 SPI OPERATIONS.......................................................................................................... 9 7.1.1 Standard SPI Instructions ................................................................................................. 9 7.1.2 Dual SPI Instructions ........................................................................................................ 9 7.1.3 Hold Function ................................................................................................................... 9 7.2 WRITE PROTECTION .................................................................................................. 10 7.2.1 Write Protect Features .................................................................................................... 10 8. CONTROL AND STATUS REGISTERS ................................................................................... 11 8.1 STATUS REGISTER .................................................................................................... 11 8.1.1 BUSY .............................................................................................................................. 11 8.1.2 Write Enable Latch (WEL) .............................................................................................. 11 8.1.3 Block Protect Bits (BP2, BP1, BP0) ................................................................................ 11 8.1.4 Top/Bottom Block Protect (TB) ....................................................................................... 11 8.1.5 Reserved Bits ................................................................................................................. 12 8.1.6 Status Register Protect (SRP) ........................................................................................ 12 8.1.7 Status Register Memory Protection ................................................................................ 13 8.2 INSTRUCTIONS ........................................................................................................... 14 8.2.1 Manufacturer and Device Identification .......................................................................... 14 (1) 8.2.2 Instruction Set ............................................................................................................. 15 8.2.3 Write Enable (06h) .......................................................................................................... 16 8.2.4 Write Enable for Volatile Status Register (50h) .............................................................. 16 8.2.5 Write Disable (04h) ......................................................................................................... 17 8.2.6 Read Status Register (05h) ............................................................................................ 17 8.2.7 Write Status Register (01h) ............................................................................................ 18 8.2.8 Read Data (03h) ............................................................................................................. 19 8.2.9 Fast Read (0Bh) ............................................................................................................. 20 8.2.10 Fast Read Dual Output (3Bh) ....................................................................................... 21 8.2.11 Fast Read Dual I/O (BBh) ............................................................................................. 22 8.2.12 Continuous Read Mode Bits (M7-0) ............................................................................. 24 8.2.13 Continuous Read Mode Reset (FFFFh) ....................................................................... 24 8.2.14 Page Program (02h) ..................................................................................................... 25 8.2.15 Sector Erase (20h) ....................................................................................................... 26 Publication Release Date: March 25, 2014 - 2 - Revision F

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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