Product Information

VSMY98525DS

VSMY98525DS electronic component of Vishay

Datasheet
Infrared Emitters - High Power H. Speed IR 850nm 1000mWsr; 14ns

Manufacturer: Vishay
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (AUD)

1: AUD 10.0138 ( AUD 11.02 Inc GST) ea
Line Total: AUD 10.0138 ( AUD 11.02 Inc GST)

442 - Global Stock
Ships to you between
Fri. 26 Jul to Tue. 30 Jul
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
442 - Global Stock


Ships to you between Fri. 26 Jul to Tue. 30 Jul

MOQ : 1
Multiples : 1

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VSMY98525DS
Vishay

1 : AUD 10.0138
10 : AUD 7.3777
25 : AUD 6.7585
100 : AUD 6.21
250 : AUD 5.8385
600 : AUD 4.9538
1200 : AUD 4.9362

     
Manufacturer
Product Category
Mounting Style
Wavelength
Radiant Intensity
If - Forward Current
Vf - Forward Voltage
Power Rating
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
Hts Code
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Notes:- Show Stocked Products With Similar Attributes.

VSMY98525DS www.vishay.com Vishay Semiconductors High Power Infrared Emitting Diode, 850 nm, Surface Emitter Technology FEATURES Package type: surface-mount Double stack technology Package form: power QFN Dimensions (L x W x H in mm): 3.85 x 3.85 x 3.00 Peak wavelength: = 850 nm p Zener diode for ESD protection up to 2 kV High radiant power High radiant intensity Angle of half intensity: = 25 Designed for high drive currents: up to 1 A (DC) and up DESCRIPTION to 5 A pulses TM As part of the SurfLight portfolio, the VSMY98525DS Low thermal resistance: R = 9 K/W thJP is an infrared, 850 nm emitting diode based on surface Floor life: 168 h, MSL 3, according to J-STD-020 emitter technology with high radiant power and high speed, Lead (Pb)-free reflow soldering molded in low thermal resistance SMD package with lens. Material categorization: for definitions of compliance A 42 mil chip provides outstanding radiant intensity and please see www.vishay.com/doc?99912 allows DC operation of the device up to 1 A. Superior ESD characteristics are ensured by an integrated Zener diode. APPLICATIONS Infrared illumination for CMOS cameras (CCTV) Illumination for cameras (3D gaming) Machine vision PRODUCT SUMMARY t (ns) COMPONENT I (mW/sr) (deg) (nm) e p r VSMY98525DS 1000 25 850 14 Note Test conditions see table Basic Characteristics ORDERING INFORMATION ORDERING CODE PACKAGING REMARKS PACKAGE FORM VSMY98525DS Tape and reel MOQ: 600 pcs, 600 pcs/reel High power with lens Note MOQ: minimum order quantity ABSOLUTE MAXIMUM RATINGS (T = 25 C, unless otherwise specified) amb PARAMETER TEST CONDITION SYMBOL VALUE UNIT Reverse voltage V 5V R Forward current I 1A F Peak forward current t /T = 0.5, t = 100 s I 2A p p FM Surge forward current t = 100 s I 5A p FSM Power dissipation P 3.5 W V Junction temperature T 115 C j Operating temperature range T -40 to +85 C amb Storage temperature range T -55 to +100 C stg Soldering temperature According to Fig. 7, J-STD-20 T 260 C sd Thermal resistance junction-to-pin JESD 51 R 9K/W thJP Rev. 1.0, 21-Mar-18 Document Number: 84908 1 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY98525DS www.vishay.com Vishay Semiconductors 4.0 1.0 3.5 3.0 0.8 2.5 0.6 R = 9 K/W thJA 2.0 R = 9 K/W thJA 0.4 1.5 1.0 0.2 0.5 0 0 0 20406080 100 0 20406080 100 T - Ambient Temperature (C) T - Ambient Temperature (C) amb amb Fig. 1 - Power Dissipation Limit vs. Ambient Temperature Fig. 2 - Forward Current Limit vs. Ambient Temperature BASIC CHARACTERISTICS (T = 25 C, unless otherwise specified) amb PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT Forward voltage I = 1 A, t = 20 ms V -3.1 3.5 V F p F Temperature coefficient of V I = 1 A - -3 - mV/K F F Reverse current V = 5 V I - - 10 A R R 2 Junction capacitance V = 0 V, f = 1 MHz, E = 0 mW/cm C -130 - pF R J Radiant intensity I = 1 A, t = 20 ms I 800 1000 1600 mW/sr F p e Radiant power I = 1 A, t = 20 ms -1300- mW F p e Temperature coefficient of I = 1 A, t = 20 ms TK - -0.3 - %/K F p Angle of half intensity - 25 - deg Peak wavelength I = 1 A 830 850 870 nm F p Spectral bandwidth I = 1 A -35- nm F Temperature coefficient of I = 1 A, t = 20 ms TK -0.3 - nm/K p F p p Rise time I = 1 A t -14- ns F r Fall time I = 1 A t -17- ns F f BASIC CHARACTERISTICS (T = 25 C, unless otherwise specified) amb 10 000 1000 t = 100 s p t = 100 s p 1000 100 100 10 10 1 2.0 3.0 4.0 5.0 10 100 1000 V - Forward Voltage (V) I - Forward Current (mA) F F Fig. 3 - Forward Current vs. Forward Voltage Fig. 4 - Relative Radiant Intensity vs. Forward Current Rev. 1.0, 21-Mar-18 Document Number: 84908 2 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 P - Power Dissipation (W) I - Forward Current (mA) V F I - Relative Radiant Intensity (%) I - Forward Current (A) e,rel F

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8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
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VSC
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