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TE0714-03-35-2I

TE0714-03-35-2I electronic component of Trenz Electronic

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System-On-Modules - SOM FPGA Module with Xilinx Artix-7 XC7A35T-2CSG325I 33 V Configuration 4 x 3 cm

Manufacturer: Trenz Electronic
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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TE0714-03-35-2I
Trenz Electronic

1 : AUD 222.5338
N/A

Obsolete
     
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TE0714 TRM Revision v.55 Exported on 2019-03-04 Online version of this document: TE0714 TRM Revision: v.55 1 Table of Contents 1 Table of Contents................................................................................................................................................... 2 2 Table of Figures...................................................................................................................................................... 4 3 Table of Tables ....................................................................................................................................................... 5 4 Overview................................................................................................................................................................. 6 4.1 Key Features........................................................................................................................................................... 6 4.2 Block Diagram ........................................................................................................................................................ 6 4.3 Main Components.................................................................................................................................................. 7 4.4 Initial Delivery State............................................................................................................................................... 8 4.5 Control Signals ....................................................................................................................................................... 8 5 Signals, Interfaces and Pins................................................................................................................................... 9 5.1 JTAG Interface........................................................................................................................................................ 9 5.2 Board to Board (B2B) I/Os ..................................................................................................................................... 9 6 On-board Peripherals .......................................................................................................................................... 10 6.1 Quad SPI Flash ..................................................................................................................................................... 10 6.2 On-board LED ....................................................................................................................................................... 10 6.3 Clock ..................................................................................................................................................................... 10 7 Power and Power-On Sequence ......................................................................................................................... 11 7.1 Power Consumption ............................................................................................................................................ 11 7.2 Power Distribution Dependencies ...................................................................................................................... 11 7.3 Power-On Sequence ............................................................................................................................................ 11 7.4 Power Rails........................................................................................................................................................... 12 7.5 Bank Voltages....................................................................................................................................................... 12 8 Board to Board Connectors................................................................................................................................. 13 8.1 Connector Speed Ratings .................................................................................................................................... 13 8.2 Current Rating ...................................................................................................................................................... 14 8.3 Connector Mechanical Ratings............................................................................................................................ 14 9 Technical Specifications...................................................................................................................................... 15 9.1 Absolute Maximum Ratings................................................................................................................................. 15 9.2 Recommended Operating Conditions ................................................................................................................ 15 9.3 Physical Dimensions ............................................................................................................................................ 15 10 Variants Currently In Production ........................................................................................................................ 17 11 Revision History ................................................................................................................................................... 18 11.1 Hardware Revision History .................................................................................................................................. 18 11.2 Document Change History .................................................................................................................................. 18 12 Disclaimer............................................................................................................................................................. 21 Copyright 2019Trenz Electronic GmbH 2 of 22

Tariff Desc

8542.31.00 63 No Hybrid integrated circuits

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits, Digital:

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