Product Information

TE0711-01-35-2C

TE0711-01-35-2C electronic component of Trenz Electronic

Datasheet
System-On-Modules - SOM High IO Xilinx Artix-7 35T Module with speedgrade 2C and USB

Manufacturer: Trenz Electronic
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (AUD)
N/A

Obsolete
Availability Price Quantity
0 - Global Stock

MOQ : 1
Multiples : 1

Stock Image

TE0711-01-35-2C
Trenz Electronic

1 : AUD 217.1923
N/A

Obsolete
     
Manufacturer
Product Category
Category
Factory Pack Quantity :
LoadingGif

Notes:- Show Stocked Products With Similar Attributes.

TE0711 TRM Revision v.35 Exported on 2019-02-21 Online version of this document: TE0711 TRM Revision: v.35 1 Table of Contents 1 Table of Contents................................................................................................................................................... 2 2 Table of Figures...................................................................................................................................................... 4 3 Table of Tables ....................................................................................................................................................... 5 4 Overview................................................................................................................................................................. 6 4.1 Key Features........................................................................................................................................................... 6 4.2 Block Diagram ........................................................................................................................................................ 7 4.3 Main Components.................................................................................................................................................. 8 4.4 Initial Delivery State............................................................................................................................................... 9 5 Signals, Interfaces and Pins................................................................................................................................. 10 5.1 Board to Board (B2B) I/Os ................................................................................................................................... 10 5.2 JTAG Interface...................................................................................................................................................... 10 5.3 System Controller I/O Pins .................................................................................................................................. 11 5.4 On-board LEDs ..................................................................................................................................................... 11 5.5 Clocking ................................................................................................................................................................ 12 6 On-board Peripherals .......................................................................................................................................... 13 6.1 32 MByte Quad SPI Flash Memory....................................................................................................................... 13 6.2 System Controller CPLD ...................................................................................................................................... 13 6.3 Dual channel USB to UART/FIFO ......................................................................................................................... 13 7 Power and Power-On Sequence ......................................................................................................................... 14 7.1 Power Supply ....................................................................................................................................................... 14 7.2 Power-On Sequence ............................................................................................................................................ 14 7.3 Power Rails........................................................................................................................................................... 15 7.4 Bank Voltages....................................................................................................................................................... 15 8 Board to Board Connectors................................................................................................................................. 16 8.1 Connector Mating height ..................................................................................................................................... 16 8.2 Connector Speed Ratings .................................................................................................................................... 17 8.3 Current Rating ...................................................................................................................................................... 17 8.4 Connector Mechanical Ratings............................................................................................................................ 17 9 Variants Currently In Production ........................................................................................................................ 18 10 Technical Specifications...................................................................................................................................... 19 10.1 Absolute Maximum Ratings................................................................................................................................. 19 10.2 Recommended Operating Conditions ................................................................................................................ 19 10.3 Operating Temperature Ranges.......................................................................................................................... 20 10.4 Physical Dimensions ............................................................................................................................................ 20 10.5 Weight................................................................................................................................................................... 21 Copyright 2019Trenz Electronic GmbH 2 of 24

Tariff Desc

8542.31.00 63 No Hybrid integrated circuits

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits, Digital:

Looking for help? Visit our FAQ's Section to answer to all your questions

 

X-ON Worldwide Electronics

Welcome To X-ON ELECTRONICS
For over three decades, we have been advocating and shaping the electronic components industry. Our management complements our worldwide business scope and focus. We are committed to innovation, backed by a strong business foundation. If you need a trustworthy supplier of electronic components for your business – look no further.
 

Copyright ©2024  X-ON Electronic Services. All rights reserved.
Please ensure you have read and understood our Terms & Conditions before purchasing.
All prices exclude GST.

Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted