MS5837-30BA Ultra-small, gel-filled, pressure sensor with stainless steel cap The MS5837-30BA is a high-resolution pressure and temperature sensor 2 from TE Connectivity (TE) with I C bus interface. This sensor is optimized for water depth measurement systems with a resolution of 0.2 cm. The sensor module includes a high linearity pressure sensor and an ultra-low power 24-bit ADC with internal factory calibrated coefficients. It provides a precise digital 24-bit pressure and temperature value and different operation modes that allow the user to optimize for conversion speed and current consumption. A high-resolution temperature output allows the implementation in depth measurement systems and thermometer function without any additional sensor. The MS5807-30BA can be interfaced to virtually any microcontroller. The communication protocol is simple, without the need of programming internal registers in the device. The gel protection and antimagnetic stainless-steel cap make the module water resistant. Small dimensions of only 3.3 x 3.3 x 2.75 mm allow integration in mobile devices. Enhanced construction and design materials allow for enhanced chemical endurance in applications with harsh liquid media environments with limited exposure. This sensor module generation is based on leading MEMS technology from TE proven experience and know-how in high volume manufacturing of sensors modules. FEATURES Ceramic and metal package: 3.3 x 3.3 x 2.75mm APPLICATIONS High resolution module: 0.2 cm (in water) Dive Computers Supply voltage: 1.5 to 3.6 V Mobile Water Depth Measurement Systems Low power: 0.6 A (standby 0.1 A at 25C) Fitness Trackers Integrated digital pressure sensor (24-bit ADC) Wearables Operating range: 0 to 30 bar, -20 to +85 C 2 I C interface No external components (internal oscillator) Water resistant sealing with 1.8 x 0.8mm O-ring High chemical endurance Shielded metal lid TE CONNECTIVITY SENSORS /// MS5837-30BA26 REV C2 12/2019 Page 1 MS5 8 37- 30B A Ultra-small, gel-filled pressure sensor with stainless steel cap PERFORMANCE SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS Parameter Symbol Conditions Min. Typ. Max Unit Supply voltage VDD -0.3 +4 V Storage temperature TS -40 +85 C (1) Overpressure P ISO 6425 50 bar max Maximum Soldering T 40 sec max 250 C max (2) Temperature Human Body ESD rating -2 +2 kV Model JEDEC standard Latch up -100 +100 mA No 78 (1): Pressure ramp up/down min 60s (2): Refer to application note 808 ELECTRICAL CHARACTERISTICS Parameter Symbol Conditions Min. Typ. Max Unit Operating Supply voltage VDD 1.5 3.0 3.6 V Operating Temperature T -20 +25 +85 C OSR 8192 20.09 4096 10.05 Supply current 2048 5.02 IDD A (1 sample per sec.) 1024 2.51 512 1.26 256 0.63 Peak supply current during conversion 1.25 mA Standby supply current at 25C (VDD = 3.0V) 0.01 0.1 A Power supply hold off for (3) internal reset VDD < 0.1V 200 ms VDD Capacitor From VDD to GND 100 470 nF (3): Supply voltage power up must be continuous from GND to VDD without any step ANALOG DIGITAL CONVERTER (ADC) Parameter Symbol Conditions Min. Typ. Max Unit Output Word 24 bit OSR 8192 14.80 16.44 18.08 4096 7.40 8.22 9.04 2048 3.72 4.13 4.54 (4) Conversion time tc ms 1024 1.88 2.08 2.28 512 0.95 1.06 1.17 256 0.48 0.54 0.60 (4): Maximum values must be used to determine waiting times in I2C communication TE CONNECTIVITY SENSORS /// MS5837-30BA REV C2 12/2019 Page 2