LIS3DSH MEMS digital output motion sensor: ultra-low-power high-performance three-axisnan accelerometer Datasheet - production data Description The LIS3DSH is an ultra-low-power high- performance three-axis linear accelerometer belonging to the nano family with an embedded state machine that can be programmed to implement autonomous applications. /* The LIS3DSH has dynamically selectable full scales of 2g/4g/6g/8g/16g and is capable of measuring accelerations with output data rates Features from 3.125 Hz to 1.6 kHz. Wide supply voltage, 1.71 V to 3.6 V The self-test capability allows the user to check the functioning of the sensor in the final Independent IOs supply (1.8 V) and supply application. voltage compatible The device can be configured to generate Ultra-low power consumption interrupt signals activated by user-defined motion 2g/4g/6g/8g/16g dynamically selectable patterns. full scale 2 The LIS3DSH has an integrated first-in, first-out I C/SPI digital output interface (FIFO) buffer allowing the user to store data in 16-bit data output order to limit intervention by the host processor. Programmable embedded state machines The LIS3DSH is available in a small thin plastic Embedded temperature sensor land grid array package (LGA) and is guaranteed to operate over an extended temperature range Embedded self-test from -40 C to +85 C. Embedded FIFO 10000 g high shock survivability Table 1. Device summary ECOPACK , RoHS and Green compliant Order Temperature Package Packaging codes range C Applications Tape and LIS3DSHTR -40 to +85 LGA-16 reel Motion-controlled user interface Gaming and virtual reality Pedometers Intelligent power saving for handheld devices Display orientation Click/double-click recognition Impact recognition and logging Vibration monitoring and compensation September 2017 DocID022405 Rev 3 1/58 This is information on a product in full production. www.st.com PP Contents LIS3DSH Contents 1 Block diagram and pin description 10 1.1 Block diagram 10 1.2 Pin description . 10 2 Mechanical and electrical specifications . 12 2.1 Mechanical characteristics 12 2.2 Electrical characteristics 13 2.3 Communication interface characteristics . 14 2.3.1 SPI - serial peripheral interface . 14 2 2.3.2 I C - inter-IC control interface 15 2.4 Absolute maximum ratings 16 2.5 Terminology . 17 2.5.1 Sensitivity 17 2.5.2 Zero-g level 17 2.6 Functionality . 17 2.6.1 Self-test . 17 2.7 Sensing element 17 2.8 IC interface 18 2.9 Factory calibration 18 3 Application hints . 19 3.1 Soldering information 19 4 Digital main blocks . 20 4.1 State machine . 20 4.2 FIFO . 21 4.2.1 Bypass mode . 21 4.2.2 FIFO mode . 21 4.2.3 Stream mode . 21 4.2.4 Stream-to-FIFO mode 21 4.2.5 Retrieving data from FIFO . 21 5 Digital interfaces . 22 2/58 DocID022405 Rev 3