HDMI2C1-14HD

HDMI2C1-14HD ESD protection and signal conditioning for HDMI 2.0 source interface Datasheet production data High integration level for minimal PCB footprint Efficient protection of sensitive HDMI ASICs Very low power consumption in stand-by mode Wake-up from stand-by through CEC bus Allow to drive long cable and poor quality cable Companion chip for STMicroelectronics STixxxx HDMI decoders Complies with the following standards HDMI 2.0 version Features IEC 61000-4-2 level 4 JESD22-A114D level 2 HDMI 2.0 (4K/2K 60fps) compliant from -40 to 85 C Applications TMDS high bandwidth and very low clamping voltage ESD protection Consumer and computer electronics HDMI 8 kV contact ESD protection on connector side source device such as: Supports direct connection to low-voltage Set-top boxes / ADSL boxes HDMI ASIC and/or CEC driver (down to DVD and Blu-Ray disk systems 1.8 V) Notebook / PC graphic cards DDC capacitive decoupling between ASIC and Game console HDMI connector and dynamic pull-up for long Home theater cable driving Back drive protection on 5 V, DDC bus and Description CEC The HDMI2C1-14HD is a fully integrated ESD CEC independent structure from main power protection and signal conditioning device for supply control links and TMDS data video channels of HDMI Ethernet and audio return channel HDMI transmitters (source). (HEAC) compatible The HDMI2C1-14HD is a simple solution that HPD pull down and signal conditioning provides HDMI designers with an easy and fast Short-circuit protection on 5 V output way to reach full compliance with the stringent Proposed in QFN 36 leads 500 m pitch HDMI 2.0 (4K/2K 60fps) on a wide temperature range. Benefits Easy hardware design and speed-up certification of HDMI 2.0 TM: HDMI: the HDMI logo and High-Definition Pin map sequence compliant with HDMI Multimedia Interface are trademarks or registered connector type A trademarks of HDMI Licensing LLC. May 2015 DocID023674 Rev 2 1/32 This is information on a product in full production. www.st.comContents HDMI2C1-14HD Contents 1 Functional description . 3 2 Application information 5 2.1 CEC line description 5 2.2 DDC functional block description 6 2.3 HEAC link and HPD line description . 9 2.3.1 HPD line description 9 2.3.2 HEAC functional block description . 10 2.4 +5V protection and fault line functional block description .11 2.5 Back drive protection 12 2.6 TMDS channels ESD protection 12 2.7 Application block diagrams 13 3 Electrical characteristics 17 4 Package information 25 4.1 QFN package information 25 4.2 Packing information . 27 5 Recommendation on PCB assembly . 28 5.1 Stencil opening design . 28 5.2 Solder paste . 29 5.3 Placement 29 5.4 PCB design preference 29 5.5 Reflow profile 30 6 Ordering information . 31 7 Revision history . 31 2/32 DocID023674 Rev 2