FLIR LEPTON Engineering Datasheet General Description Lepton is a complete long-wave infrared (LWIR) camera module designed to interface easily into native mobile-device interfaces and other consumer electronics. It captures infrared radiation input in its nominal response wavelength band (from 8 to 14 microns) and outputs a uniform thermal image with 1 radiometry to provide temperature image with measurements. 2 Lepton Features Uses standard cell-phone-compatible Integral shutter configuration power supplies: 2.8 V to sensor, 1.2 V to Configurations with 25, 50 and 57 digital core, and flexible IO from 2.8 V HFOV (f/1.1 silicon doublet) to 3.1 V LWIR sensor, wavelength 8 to 14 m Fast time to image (< 1.2 sec) Arrays with 80x60 and 160x120 active Low operating power pixels available o Nominally 160 mW Thermal sensitivity <50 mK o 800mW typical during shutter Integrated digital thermal image event (~1s) processing functions, including o Low power mode 5 mW automatic thermal environment RoHS compliant compensation, noise filters, non- 32- pin socket interface to standard uniformity correction, and gain control 1 Molex or similar side-contact connector Radiometric accuracy (35C blackbody) o High gain: 5C 25C Applications o Low gain 10C 25C 1 Radiometric Leptons feature Mobile phones temperature measurement including Gesture recognition per pixel and frame radiometric output Building automation (TLinear) and Spotmeter Thermal imaging Export compliant frame rate (< 9 Hz) Night vision SPI video interface Two-wire I2C serial control interface 1 2 Radiometric Leptons are 2.5 and 3.5. All specifications subject to change without notice Information on this page is subject to change without notice. Lepton Engineering Datasheet, Rev: 200 1 FLIR LEPTON Engineering Datasheet Contents 1 INTRODUCTION ............................................................................................................................................................. 6 1.1 REVISION HISTORY ............................................................................................................................................................. 6 1.2 CONTACT US ..................................................................................................................................................................... 6 1.3 REFERENCES ..................................................................................................................................................................... 6 1.4 DEVICE OVERVIEW ............................................................................................................................................................. 7 1.5 KEY SPECIFICATIONS ........................................................................................................................................................... 8 1.6 SYSTEM ARCHITECTURE ...................................................................................................................................................... 9 2 FUNCTIONAL DESCRIPTION ......................................................................................................................................... 11 2.1 FPA INTERFACE MODULE.................................................................................................................................................. 11 2.2 SYSTEM CONTROL (SYS CTRL) MODULE ............................................................................................................................... 11 2.3 POWER MANAGEMENT MODULE ....................................................................................................................................... 11 2.4 SOFTWARE-BASED VIDEO PROCESSING (SVP CORE) MODULE .................................................................................................. 12 2.5 MEMORY SYSTEM (MEMORY SYS) MODULE ......................................................................................................................... 12 2.6 GENERAL PURPOSE PROCESSOR (GPP) ................................................................................................................................ 12 2.7 VIDEO INTERFACE MODULE (VIDEO IF) ................................................................................................................................ 12 2.8 ONE-TIME PROGRAMMABLE MEMORY (OTP) ...................................................................................................................... 12 2.9 STATIC RANDOM-ACCESS MEMORY (SRAM) ....................................................................................................................... 12 2.10 GPIO INTERFACE MODULE (GPIO IF) ................................................................................................................................. 12 2.11 VIDEO PIPELINE ............................................................................................................................................................... 12 2.11.1 NUC .................................................................................................................................................................... 13 2.11.2 Defect Replacement ........................................................................................................................................... 13 2.11.3 Spatial / Temporal Filtering ............................................................................................................................... 13 2.11.4 AGC .................................................................................................................................................................... 13 2.11.5 Colorize .............................................................................................................................................................. 13 2.12 MASTER CLOCK ............................................................................................................................................................... 14 3 OPERATING STATES AND MODES ................................................................................................................................ 14 3.1 POWER STATES ............................................................................................................................................................... 14 3.2 FFC STATES .................................................................................................................................................................... 17 3.3 GAIN STATES .................................................................................................................................................................. 21 3.4 TELEMETRY MODES ......................................................................................................................................................... 22 3.5 RADIOMETRY MODES ....................................................................................................................................................... 29 3.5.1 Radiometry Enabled - TLinear ................................................................................................................................ 29 Information on this page is subject to change without notice. Lepton Engineering Datasheet, Rev: 200 2