Product Information

ETRX3587

ETRX3587 electronic component of Silicon Labs

Datasheet
Zigbee Modules (802.15.4) Telegesis ETRX3587 Radio Module with 512 kB Flash and 64 kB of RAM +3 dBm output power (+8 dBm in b

Manufacturer: Silicon Labs
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (AUD)

600: AUD 28.16 ( AUD 30.98 Inc GST) ea
Line Total: AUD 16896 ( AUD 18585.6 Inc GST)

0 - Global Stock
MOQ: 600  Multiples: 600
Pack Size: 600
Availability Price Quantity
0 - Global Stock


Ships to you between Mon. 22 Jul to Fri. 26 Jul

MOQ : 600
Multiples : 600

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ETRX3587
Silicon Labs

600 : AUD 28.16
6000 : AUD 27.84
60000 : AUD 26.04
300000 : AUD 25.12

0 - Global Stock


Ships to you between Fri. 26 Jul to Tue. 30 Jul

MOQ : 600
Multiples : 600

Stock Image

ETRX3587
Silicon Labs

600 : AUD 41.5769
1200 : AUD 41.0285

     
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RoHS - XON
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Notes:- Show Stocked Products With Similar Attributes.

Telegesis TG-ETRX35X-PM-010-121 ETRX351 and ETRX357 Product Manual 1.21 ETRX35x ZIGBEE MODULES PRODUCT MANUAL 2019 Silicon Labs ETRX35x Product Manual Not Recommended for New Designs ETRX351 and ETRX357 Table of Contents 1 INTRODUCTION ................................................................................................................. 5 1.1 Hardware Description ....................................................................................................... 5 2 PRODUCT APPROVALS ........................................................................................................ 6 2.1 FCC Approvals ................................................................................................................. 6 FCC Labelling Requirements ........................................................................................... 7 2.2 IC (Industry Canada) Approvals............................................................................................ 7 2.3 European Certification (ETSI) ........................................................................................... 8 2.4 ICASA Approvals .............................................................................................................. 8 2.5 Australia and New Zealand (C-Tick) ................................................................................. 8 2.6 Brazil ................................................................................................................................ 9 2.7 Declarations of Conformity ............................................................................................... 9 2.8 IEEE 802.15.4 .................................................................................................................. 9 2.9 The Zigbee Protocol ....................................................................................................... 10 3 MODULE PINOUT ................................................................................................................. 11 4 HARDWARE DESCRIPTION ............................................................................................ 13 4.1 Hardware Interface ......................................................................................................... 13 5 FIRMWARE DESCRIPTION .............................................................................................. 14 5.1 Token Settings ............................................................................................................... 15 5.2 Custom Firmware ........................................................................................................... 15 5.3 Software Interface .......................................................................................................... 16 6 ABSOLUTE MAXIMUM RATINGS ................................................................................. 17 6.1 Environmental Characteristics ........................................................................................ 17 6.2 Recommended Operating Conditions ............................................................................. 17 7 DC ELECTRICAL CHARACTERISTICS ........................................................................... 18 8 DIGITAL I/O SPECIFICATIONS ........................................................................................ 20 9 A/D CONVERTER CHARACTERISTICS ........................................................................ 21 10 AC ELECTRICAL CHARACTERISTICS ......................................................................... 21 10.1 TX Power Characteristics ............................................................................................... 23 11 PHYSICAL DIMENSIONS ................................................................................................. 25 12 RECOMMENDED SOLDERING TEMPERATURE PROFILE ............................................ 27 13 PRODUCT LABEL DRAWING .......................................................................................... 28 14 RECOMMENDED FOOTPRINT ........................................................................................ 29 14.1 Pad dimensions .............................................................................................................. 29 14.2 Recommended Placement.................................................................................................. 30 14.3 Example carrier board .................................................................................................... 32 15 RELIABILITY TESTS ............................................................................................................ 33 16 APPLICATION NOTES .................................................................................................. 33 16.1 Safety Precautions ......................................................................................................... 33 16.2 Design Engineering Notes .................................................................................................. 33 2019 Silicon Labs - 2 - ETRX35x Product Manual (Rev 1.21) Not Recommended for New Designs

Tariff Desc

8542.3 - Electronic integrated circuits:
8542.31.00 -- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
.Digital:
61 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products
62 No ..Other
63 No Hybrid integrated circuits
64 No Multichip integrated circuits
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