Product Information

ETRX357

ETRX357 electronic component of Silicon Labs

Datasheet
Zigbee Modules - 802.15.4 Telegesis ETRX357 Zigbee Radio Module, Chip Antenna, R309

Manufacturer: Silicon Labs
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (AUD)

1: AUD 51.8048 ( AUD 56.99 Inc GST) ea
Line Total: AUD 51.8048 ( AUD 56.99 Inc GST)

5947 - Global Stock
Ships to you between
Wed. 17 Jul to Fri. 19 Jul
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
5845 - Global Stock


Ships to you between Wed. 17 Jul to Fri. 19 Jul

MOQ : 1
Multiples : 1

Stock Image

ETRX357
Silicon Labs

1 : AUD 50.2108
10 : AUD 46.3185
25 : AUD 42.4792
50 : AUD 42.4085
100 : AUD 39.2238
250 : AUD 37.2777
600 : AUD 33.7569
1200 : AUD 33.6862
2400 : AUD 33.6331

     
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RoHS - XON
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Supply Current Receiving
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Antenna Connector Type
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Notes:- Show Stocked Products With Similar Attributes.

Telegesis TG-ETRX35X-PM-010-121 ETRX351 and ETRX357 Product Manual 1.21 ETRX35x ZIGBEE MODULES PRODUCT MANUAL 2019 Silicon Labs ETRX35x Product Manual Not Recommended for New Designs ETRX351 and ETRX357 Table of Contents 1 INTRODUCTION ................................................................................................................. 5 1.1 Hardware Description ....................................................................................................... 5 2 PRODUCT APPROVALS ........................................................................................................ 6 2.1 FCC Approvals ................................................................................................................. 6 FCC Labelling Requirements ........................................................................................... 7 2.2 IC (Industry Canada) Approvals............................................................................................ 7 2.3 European Certification (ETSI) ........................................................................................... 8 2.4 ICASA Approvals .............................................................................................................. 8 2.5 Australia and New Zealand (C-Tick) ................................................................................. 8 2.6 Brazil ................................................................................................................................ 9 2.7 Declarations of Conformity ............................................................................................... 9 2.8 IEEE 802.15.4 .................................................................................................................. 9 2.9 The Zigbee Protocol ....................................................................................................... 10 3 MODULE PINOUT ................................................................................................................. 11 4 HARDWARE DESCRIPTION ............................................................................................ 13 4.1 Hardware Interface ......................................................................................................... 13 5 FIRMWARE DESCRIPTION .............................................................................................. 14 5.1 Token Settings ............................................................................................................... 15 5.2 Custom Firmware ........................................................................................................... 15 5.3 Software Interface .......................................................................................................... 16 6 ABSOLUTE MAXIMUM RATINGS ................................................................................. 17 6.1 Environmental Characteristics ........................................................................................ 17 6.2 Recommended Operating Conditions ............................................................................. 17 7 DC ELECTRICAL CHARACTERISTICS ........................................................................... 18 8 DIGITAL I/O SPECIFICATIONS ........................................................................................ 20 9 A/D CONVERTER CHARACTERISTICS ........................................................................ 21 10 AC ELECTRICAL CHARACTERISTICS ......................................................................... 21 10.1 TX Power Characteristics ............................................................................................... 23 11 PHYSICAL DIMENSIONS ................................................................................................. 25 12 RECOMMENDED SOLDERING TEMPERATURE PROFILE ............................................ 27 13 PRODUCT LABEL DRAWING .......................................................................................... 28 14 RECOMMENDED FOOTPRINT ........................................................................................ 29 14.1 Pad dimensions .............................................................................................................. 29 14.2 Recommended Placement.................................................................................................. 30 14.3 Example carrier board .................................................................................................... 32 15 RELIABILITY TESTS ............................................................................................................ 33 16 APPLICATION NOTES .................................................................................................. 33 16.1 Safety Precautions ......................................................................................................... 33 16.2 Design Engineering Notes .................................................................................................. 33 2019 Silicon Labs - 2 - ETRX35x Product Manual (Rev 1.21) Not Recommended for New Designs

Tariff Desc

8542.3 - Electronic integrated circuits:
8542.31.00 -- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
.Digital:
61 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products
62 No ..Other
63 No Hybrid integrated circuits
64 No Multichip integrated circuits
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