SGP40-D-R4

Datasheet SGP40 Indoor Air Quality Sensor for VOC Measurements MOx based gas sensor for indoor air quality applications Outstanding long-term stability and lifetime 2 I C interface with digital output signal 3 Very small 6-pin DFN package: 2.44 x 2.44 x 0.85 mm Low power consumption: 2.6 mA at 3.3 V Tape and reel packaged, reflow solderable Product Summary The SGP40 is a digital gas sensor designed for easy VOC Algorithm feature an unmatched robustness integration into air purifiers or demand-controlled against contaminating gases present in real-world ventilation systems. Sensirions CMOSens technology applications enabling a unique long-term stability as offers a complete, easy-to-use sensor system on a single well as low drift and device-to-device variation. The very 2 3 chip featuring a digital I C interface and a temperature- small 2.44 x 2.44 x 0.85 mm DFN package enables controlled micro hotplate, providing a humidity- applications in limited spaces. Sensirions compensated VOC based indoor air quality signal. The state-of-the-art production process guarantees high output signal can be directly processed by Sensirions reproducibility and reliability. Tape and reel packaging powerful VOC Algorithm to translate the raw signal into a together with suitability for standard SMD assembly VOC Index as a robust measure for indoor air quality. The processes make the SGP40 predestined for high- VOC Algorithm automatically adapts to the environment volume applications. the sensor is exposed to. Both sensing element and Figure 1 Functional block diagram of the SGP40. www.sensirion.com Version 1.1 September 2021 1/19 Table of Contents 1 Sensor Performance ................................................................................................................................................................ 3 2 Specifications .......................................................................................................................................................................... 5 2.1 Electrical Specifications ..................................................................................................................................................... 5 2.2 Timing Specifications ......................................................................................................................................................... 5 2.3 Recommended Operating and Storage Conditions ........................................................................................................... 5 2.4 Absolute Minimum and Maximum Ratings ......................................................................................................................... 6 2.5 Hardware Interface Specifications ..................................................................................................................................... 7 2.6 Environmental Stability ...................................................................................................................................................... 8 2.7 Material Contents ............................................................................................................................................................... 8 3 Sensor Output Signal Description ......................................................................................................................................... 9 3.1 Raw Signal Measurement .................................................................................................................................................. 9 3.2 VOC Index Measurement .................................................................................................................................................. 9 3.3 Built-in Self-Test ............................................................................................................................................................... 10 3.4 Reading out The Sensor Serial Number .......................................................................................................................... 10 3.5 Sensor Start-up Behavior ................................................................................................................................................. 10 4 Digital Interface Description ................................................................................................................................................. 11 4.1 General Considerations ................................................................................................................................................... 11 2 4.2 I C Address ...................................................................................................................................................................... 11 2 4.3 I C Voltage Levels ............................................................................................................................................................ 11 2 4.4 I C Protocol Speed ........................................................................................................................................................... 11 2 4.5 I C Sequences ................................................................................................................................................................. 11 4.6 Checksum Calculation ..................................................................................................................................................... 12 2 4.7 I C Commands ................................................................................................................................................................. 12 5 Mechanical Specifications .................................................................................................................................................... 15 5.1 Traceability ....................................................................................................................................................................... 15 5.2 Package Outline ............................................................................................................................................................... 15 5.3 Land Pattern .................................................................................................................................................................... 16 5.4 Soldering Instructions ...................................................................................................................................................... 16 6 Ordering Information ............................................................................................................................................................. 17 6.1 Packaging Information ..................................................................................................................................................... 17 www.sensirion.com Version 1.1 September 2021 2/19