Ver. 201306 Multilayer Power Inductor CIG22H Series (2520/ EIA 1008) APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN High Current Type Low DC resistance Magnetically shielded structure Free of all RoHS-regulated substances Monolithic structure for high reliability DIMENSION Dimension mm TYPE L W T D 22 2.50.2 2.00.2 1.10.1 0.550.25 DESCRIPTION 2 1 Rated Current (A) Size Inductance DC Rated Current (A) Part no. inch/mm) uH) 1MHz Resistance( Typ. ( ( ) Max. Typ. CIG22H1R0MNE 1008/2520 1.0 20 % 0.08025 % 3.3 1.5 2.0 CIG22H1R2MNE 1008/2520 1.2 20 % 0.09420 % 2.8 1.5 1.9 CIG22H1R5MNE 1008/2520 1.5 20 % 0.10420 % 2.4 1.5 1.6 CIG22H2R2MNE 1008/2520 2.2 20 % 0.11620 % 1.8 1.2 1.6 CIG22H3R3MNE 1008/2520 3.3 20 % 0.13320 % 1.0 1.0 1.5 CIG22H4R7MNE 1008/2520 4.7 20 % 0.23320 % 0.95 0.8 1.0 1 Rated Current (A) : DC current value when Inductance drops to 30% of nominal Inductance value (ONLY REFERENCE) 2 Rated Current (A) : DC current value when the self-generation of heat rises to 40 (Reference ambient temperature:25 ) Operating temperature range: 40 to +125C ( Including self-temperature rise) Test equipment: Agilent :E4991A+16092A CHARACTERISTIC DATA Frequency characteristics Typ.) DC Bias characteristics Typ.) 1) ( 2) (Ver. 201306 PRODUCT IDENTIFICATION CI G 22 H 1R0 M N E (1) (2) (3) (4) (5) (6) (7) (8) Chip Inductor Power Inductor (1) (2) Dimension Product Series H:High Current Type) (3) (4) ( Inductance R0:1.0uH) Tolerance M: (5) (1 (6) ( 20%) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard) (7) Packaging(C:paper tape, E:embossed tape) (8) RECOMMENDED SOLDERING CONDITION FLOW SOLDERING REFLOW SOLDERING PACKAGING Packaging Style Quantity(pcs/reel) Embossed Taping 2,500 Any data in this sheet are subject to change, modify or discontinue without notice. The data sheets include the typical data for design reference only. If there is any question regarding the data sheets, please contact our sales personnel or application engineers.