Low Power 6LoWPAN ZWIR4532 Communication Module Datasheet Description Features The ZWIR4532 is a programmable low-power secure IPv6 License-free 868/915 MHz frequency bands communication module for internet of things (IOT) device networks. 4 channels in EU frequency band (865.3 868.3 MHz) Sensors and devices can operate autonomously or connect to local 10 channels in US frequency band (906 924 MHz) or global IPv6 networks using the ZWIR4532. The ZWIR4532 BPSK or O-QPSK modulation selectable serves as a universal secure radio communication module for BPSK with 20kBps EU and 40kBps U applications with low bandwidth requirements. ARM Cortex-M0+ 32-bit ultra-low-power microcontroller The module incorporates an ultra-low-power ARM Cortex-M0+ 192kB flash and 20kB RAM 32-bit microcontroller which is running the network stack. In 6kByte EEPROM addition, the user application can run on the microcontroller. This 5 UART interfaces helps minimizing the size, complexity and overall BOM. A rich set 1 SPI interface of digital and analog peripherals is available for interfacing with external application components. Approximately 128kB of flash 3 IC interfaces and 4kB of RAM are available for user applications. 10 PWM outputs IDT offers the SensorShare user programmable royalty-free 12 bit ADC with 10 input channels 6LoWPAN network stack with mesh routing capability for the 2 analog comparators ZWIR4532. 6LoWPAN is an Internet Engineering Task Force (IETF) 31 GPIOs standard for wireless low-power IPv6-based sensor and device Network Stack networks. UDP/IPv6 communication Secure communication is provided by a standard-compliant Mesh networking with hundreds of nodes implementation of the Internet Protocol Security (IPSec) protocol Self-healing defective routes suite. Over-the-Air update capable Network layer security Typical Applications Ultra-low power stop mode: < 1A with full RAM retention Industrial automation Supply voltage: 1.8V to 3.3V Home and building automation -40C to +85C ambient operating temperature Health monitoring 15.6 12 mm 43-LGA Package Telemetry Block Diagram 2018 Integrated Device Technology, Inc. 1 September 6, 2018 ZWIR4532 Datasheet Contents 1. Pin Assignments ...........................................................................................................................................................................................3 2. Pin Descriptions ............................................................................................................................................................................................3 3. Absolute Maximum Ratings ..........................................................................................................................................................................7 4. Recommended Operating Conditions ..........................................................................................................................................................8 5. Functional Overview .....................................................................................................................................................................................9 5.1 Low Power Modes .............................................................................................................................................................................10 5.2 Device Programming and Debugging ................................................................................................................................................10 6. Package Outline Drawing ...........................................................................................................................................................................11 7. Soldering Information .................................................................................................................................................................................12 8. Certification .................................................................................................................................................................................................13 8.1 European RED Statement .................................................................................................................................................................13 8.2 Federal Communication Commission Certification Statements .........................................................................................................13 8.2.1 Statements .........................................................................................................................................................................13 8.2.2 Requirements .....................................................................................................................................................................13 8.2.3 Supported Antennas ...........................................................................................................................................................14 9. Ordering Information ...................................................................................................................................................................................15 10. Revision History ..........................................................................................................................................................................................15 List of Figures Figure 1. Pin Assignments for 15.6mm 12.0mm LGA Package Top View ...................................................................................................3 Figure 2. Serial Wire Debug Connection with Standard ARM Connectors .......................................................................................................10 Figure 3. Package Outline Drawing (Top, Left and Bottom View) ....................................................................................................................11 Figure 5. Recommended Temperature Profile for Reflow Soldering (according to J-STD-020D) ....................................................................12 Figure 6. FCC Compliance Statement to be Printed on Equipment Incorporating ZWIR4532 Devices ............................................................14 List of Tables Table 1. Pin Descriptions ...................................................................................................................................................................................3 Table 2. Module Pins Peripheral Function Mapping ..........................................................................................................................................6 Table 3. Absolute Maximum Ratings .................................................................................................................................................................7 Table 4. Recommended Operating Conditions .................................................................................................................................................8 Table 5. ZWIR4532 Physical Dimensions and Tolerances..............................................................................................................................11 Table 6. Soldering Profile Parameters (according to J-STD-020D) .................................................................................................................12 2018 Integrated Device Technology, Inc. 2 September 6, 2018