DDR4 Temperature Sensor with Integrated TSE2004GB2C0 4Kbit EEPROM for Memory Module Datasheet Description Features Compliant to JEDEC TSE2004av Device Specification The TSE2004GB2C0 digital temperature sensor comes with (JEDEC Standard No. 21-C, Section 4.1.6) several user-programmable registers to provide maximum flexibility for temperature-sensing applications. The user- Temperature Sensor plus a 512-byte Serial EEPROM programmable registers specify critical, upper and lower A 512-byte Serial EEPROM for SPD temperature limits, as well as hysteresis settings. Both the limits Single supply: 2.2V to 3.6V and hysteresis values are used for communicating temperature Accurate timeout support that meets strict SMBus events from the chip to the system. This communication is done specifications for: 25ms (minimum), 35ms (maximum) using the EVENT n pin, which has an open-drain configuration. The user has the option of setting the EVENT n pin polarity as Timeout supported for Temperature Sensor and EEPROM either an active-low or active-high comparator output for Timeout supported in all modes: thermostat operation, or as a temperature event interrupt output Active mode for Temperature Sensor and EEPROM for microprocessor-based systems. EEPROM in standby or Temperature Sensor in shutdown 2 The sensor uses an industry standard 2-wire, I C/SMBus serial EEPROM in standby and Temperature Sensor in shutdown interface, and allows up to eight devices to be controlled on the Schmitt trigger and noise filtering on bus inputs bus. A 2-wire serial interface: 10kHz to 1MHz (maximum) The 4Kbit (512 bytes) Serial EEPROM memory in the part is 2 I C/ SMBus organized as two pages of 256 bytes each, or 512 bytes of total Available package: 8-DFN, 2.0 3.0 0.75 mm memory. Each page is comprised of two 128 byte blocks. The device can selectively lock the data in any or all of the four 128-byte blocks. Temperature Sensor Features Temperature converted to digital data Typical Applications Sampling rate of 125ms (maximum) DIMM modules (DDR3, DDR4) Selectable 0, 1.5C, 3C, 6C Hysteresis Servers, laptops, ultra-portables, PCs, etc. Programmable resolution from 0.0625C to 0.5C Industrial temperature monitors Accuracy: Hard disk drives and other PC peripherals 0.5C / 1.0C (typ./max.) from +75C to +95C Figure 1. Memory Module Temperature Sensor 1.0C / 2.0C (typ./max.) from +40C to +125C Application 2.0C / 3.0C (typ./max.) from -40C to +125C Memory Module Serial EEPROM Features Individual Reversible Software Data Protection for all CPU DRAMs 128-byte blocks Byte and page (up to 16 bytes) Write operation (for memory throttling) Self-time Write cycle EVEEVENNT nT Temperature Automatic address incrementing sensor and SM Bus EEPROM Chipset Random and sequential Read modes DRAMs Memory Bus MC H 2018 Integrated Device Technology, Inc. 1 May 10, 2018TSE2004GB2C0 Datasheet Contents Description 1 Typical Applications . 1 Features 1 Temperature Sensor Features 1 Serial EEPROM Features 1 Pin Assignments 4 Functional Description . 4 Serial Clock (SCL) 4 Serial Data (SDA) 4 Select Address (SA0, SA1, SA2) 5 EVENT n 5 Serial Communications 6 Absolute Maximum Ratings . 7 DC and AC Parameters 7 DC Characteristics 9 AC Characteristics . 10 Temperature-to-Digital Conversion Performance 11 Serial Address Selection 12 Interface Protocol 13 Start Condition . 14 Stop Condition 14 Acknowledge Bit (ACK) . 14 No Acknowledge Bit (NACK) . 14 Data Input . 14 Memory Addressing . 15 I2C Bus Operating Modes . 16 Device Reset and Initialization . 16 Software Write Protect . 17 SWPn and CWP: Set and Clear Write Protection . 17 RPSn: Read Protection Status . 17 SPAn: Set SPD Page Address . 17 RPA: Read SPD Page Address 17 Write Operations 18 Byte Write . 18 Page Write 18 Write Cycle Polling Using ACK . 19 Read Operations 20 Random Address Read . 20 Current Address Read . 20 Sequential Read 21 Acknowledge in Read Mode . 21 Temperature Sensor (TS) Device Operation 21 Write Operations 21 Read Operations 22 Device Registers 23 Capabilities Register . 24 Configuration Register . 25 2018 Integrated Device Technology, Inc. 2 May 10, 2018