F2950EVBI

High Linearity SP2T Wi-Fi RF Switch F2950 100MHz to 8GHz Datasheet Description Features Low insertion loss: 0.58dB at 2.5GHz The F2950 is a high power, reflective 50, single-pole double- High isolation: 44dB at 2.5GHz throw (SP2T) RF switch. This device covers a 100MHz to 8GHz frequency range to support a wide variety of applications including Excellent linearity: WLAN 802.11. IIP3 +69dBm at 2.4GHz and 5.9GHz IIP2 +115dBm at 2.4GHz The F2950 uses a single positive supply voltage and is compatible with both 1.8V and 3.3V control logic. IIP2 +117dBm at 5.9GHz Second Harmonic: -93dBc at 5.9GHz Competitive Advantage Third Harmonic: -85dBc at 5.9GHz Typical switching speed: 170ns The F2950 provides extremely low insertion loss across a very Supply voltage: +2.7V to +5.5V broad bandwidth while providing high linearity performance across its operating range. 1.8V and 3.3V compatible control logic -40C to +105C operating temperature range Optimized for Wi-Fi applications 1.5mm x 1.5mm, 6-pin DFN package Wide bandwidth Low insertion loss Block Diagram Excellent linearity High power handling for large peak-to-average applications Figure 1. Block Diagram Fast switching No external matching required Minimal footprint RFC Typical Applications 802.11 Wi-Fi RF1 RF2 Wireless Access Points, Gateways and Router Applications LTE and 4G Communication Systems 2-Way Radios General Purpose VCC V CTL 2017 Integrated Device Technology, Inc. 1 Rev O Aug 8, 2017 F2950 Datasheet Pin Assignments Figure 2. Pin Assignments for 1.5mm x 1.5mm x 0.55mm DFN, NEG6 Top View RF1 VCTL 1 6 EP F2950 GND RFC 2 5 VCC 3 4 RF2 Pin Descriptions Table 1. Pin Descriptions Pin Name Function 1 V Logic control pin. See Table 7 for logic control states. CTL RF common port. Matched to 50 in the insertion loss state only. If this pin is not 0V DC, then an external 2 RFC coupling capacitor must be used. 3 V Power supply. Bypass to GND with capacitors as close as possible to the pin. CC RF2 port. Matched to 50 in the insertion loss state only. If this pin is not 0V DC, then an external coupling 4 RF2 capacitor must be used. 5 GND Ground. Ground this pin as close to the device as possible. RF1 port. Matched to 50 in the insertion loss state only. If this pin is not 0V DC, then an external coupling 6 RF1 capacitor must be used. Exposed pad. Internally connected to GND. Solder this exposed pad to a PCB pad that uses multiple EP ground vias to provide heat transfer out of the device into the PCB ground planes. These multiple ground vias are also required to achieve the specified RF performance. 2017 Integrated Device Technology, Inc. 2 Rev O August 8, 2017