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ENW-89848A1KF Panasonic
No. REV. CLASSIFICATION PRODUCT SPECIFICATION DS-1761-2400-102 0.6 CLASS 2 BLUETOOTH LOW ENERGY + NFC SUBJECT PAGE 1 of 29 SINGLE MODE MODULE CUSTOMERS CODE PANASONICS CODE DATE 23.08.2016 PAN1761 ENW89848A1KF Product Specification Applicant / Manufacturer Panasonic Industrial Devices Europe GmbH Hardware Zeppelinstrasse 19 21337 Lneburg Germany Applicant / Manufacturer Toshiba Software Software Version Please refer to chapter 19 By purchase of any of products described in this document the customer accepts the document s validity and declares their agreement and understanding of its contents and recommendations. Panasonic reserves the right to make changes as required without notification. APPROVED CHECKED DESIGNED Power Electronics R&D Center genehmigt geprft erstellt Wireless Connectivity Panasonic Industrial Devices Europe GmbH No. REV. CLASSIFICATION PRODUCT SPECIFICATION DS-1761-2400-102 0.6 CLASS 2 BLUETOOTH LOW ENERGY + NFC SUBJECT PAGE 2 of 29 SINGLE MODE MODULE CUSTOMERS CODE PANASONICS CODE DATE 23.08.2016 PAN1761 ENW89848A1KF TABLE OF CONTENTS 1. Scope of this Document ................................................................................................ 4 2. Key Features ................................................................................................................. 4 3. Bluetooth Low Energy ................................................................................................... 5 4. Applications for the Module ........................................................................................... 5 5. Description for the Module ............................................................................................. 5 6. Detailed Description ...................................................................................................... 6 6.1. PAN1761 Terminal Layout ................................................................................... 6 7. PAN1761 Block Diagram ............................................................................................... 8 8. Test Conditions ............................................................................................................. 9 9. General Device Requirements and Operation ............................................................... 9 9.1. Absolute Maximum Ratings .................................................................................. 9 9.2. Recommended Operating Conditions ................................................................... 9 9.3. Power up sequence ........................................................................................... 10 9.4. PAN1761 Current Consumption ......................................................................... 10 10. Bluetooth RF Performance .......................................................................................... 11 10.1. PAN1761 Bluetooth Characteristics ................................................................... 11 10.2. PAN1761 NFC tag Interface ............................................................................... 11 10.2.1. NFC Operational Sequence .................................................................. 12 Soldering Temperature-Time Profile (for reflow soldering) .................................................... 13 10.3. For lead solder ................................................................................................... 13 10.4. For leadfree solder ............................................................................................. 13 11. PAN1761 Module Dimension ...................................................................................... 14 12. Footprint of the Module ............................................................................................... 15 13. Case Marking .............................................................................................................. 16 13.1. Example for Marking .......................................................................................... 16 13.2. Marking Definition .............................................................................................. 16 14. Mechanical Requirements ........................................................................................... 16 15. Development of Applications ....................................................................................... 17 16. Reliability Tests ........................................................................................................... 17 17. Cautions ...................................................................................................................... 17 17.1. Design Notes ..................................................................................................... 17 17.2. Installation Notes ................................................................................................ 18 17.3. Usage Conditions Notes ..................................................................................... 18 17.4. Storage Notes .................................................................................................... 19 17.5. Safety Cautions .................................................................................................. 19 17.6. Other cautions .................................................................................................... 19 18. Packaging ................................................................................................................... 21 18.1. PAN1761 Tape Dimension ................................................................................. 21 18.2. Packing in Tape ................................................................................................. 22 PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de
