ENW-89829C2KF

No. REV. CLASSIFICATION PRODUCT SPECIFICATION DS-13xx-2400-102 5.1 SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 1 of 55 CUSTOMERS CODE PANASONICS CODE DATE 08.11.2017 PAN13XX Core Specification See Chapter Ordering Information Product Specification Manufacturer Panasonic Industrial Devices Europe GmbH Zeppelinstrasse 19 21337 Lneburg Germany By purchase of any of the products described in this document the customer accepts the document s validity and declares their agreement and understanding of its contents and recommendations. Panasonic reserves the right to make changes as required at any time without notification. Please consult the most recently issued Product Specification before initiating or completing a design. Panasonic Industrial Devices Europe GmbH 2017. All rights reserved. This Product Specification does not lodge the claim to be complete and free of mistakes. APPROVED CHECKED DESIGNED Power Electronics R&D Center Wireless Connectivity Panasonic Industrial Devices Europe GmbH No. REV. CLASSIFICATION PRODUCT SPECIFICATION DS-13xx-2400-102 5.1 SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 2 of 55 CUSTOMERS CODE PANASONICS CODE DATE 08.11.2017 PAN13XX Core Specification See Chapter Ordering Information TABLE OF CONTENTS 1 About this document....................................................................................................................... 4 1.1 Purpose .............................................................................................................................................. 4 1.2 Revision History ................................................................................................................................. 4 1.3 Related Documents ........................................................................................................................... 5 1.4 General Information ........................................................................................................................... 5 1.5 Contact Us ......................................................................................................................................... 6 2 New PAN13x5B, PAN13x6B .......................................................................................................... 7 3 Key Features .................................................................................................................................. 8 4 Applications for the Module ............................................................................................................ 8 5 Description for the Module ............................................................................................................. 9 6 Detailed Description .....................................................................................................................10 6.1 Terminal Layout ............................................................................................................................... 10 6.2 Pin Description ................................................................................................................................. 11 6.3 Device Power Supply ....................................................................................................................... 12 6.4 Clock Inputs ..................................................................................................................................... 14 7 Bluetooth Features .......................................................................................................................14 8 Block Diagram ..............................................................................................................................15 9 Test Conditions ............................................................................................................................16 10 General Device Requirements and Operation .............................................................................16 10.1 Absolute Maximum Ratings ............................................................................................................. 16 10.2 Recommended Operating Conditions .............................................................................................. 17 10.3 Current Consumption ....................................................................................................................... 17 10.4 General Electrical Characteristics .................................................................................................... 18 10.5 nSHUTD Requirements ................................................................................................................... 18 10.6 External Digital Slow Clock Requirements ....................................................................................... 18 11 Host Controller Interface ..............................................................................................................19 12 Audio/Voice Codec Interface ........................................................................................................20 12.1 PCM Hardware Interface .................................................................................................................. 20 12.2 Data Format ..................................................................................................................................... 20 12.3 Frame Idle Period ............................................................................................................................ 21 12.4 Clock-Edge Operation ...................................................................................................................... 21 12.5 Two-Channel PCM Bus Example ..................................................................................................... 22 12.6 Audio Encoding ................................................................................................................................ 22 12.7 Improved Algorithm For Lost Packets .............................................................................................. 22 12.8 Bluetooth/PCM Clock Mismatch Handling........................................................................................ 23 12.9 Bluetooth Inter-IC Sound (I2S) ......................................................................................................... 23 12.10 Current Consumption for Different Bluetooth Scenarios .................................................................. 23 13 Bluetooth RF Performance ...........................................................................................................24 14 Soldering Temperature-Time Profile (for reflow soldering) ..........................................................27 14.1 For leadfree solder ........................................................................................................................... 27 15 Module Dimension ........................................................................................................................28 15.1 Module Dimensions PAN131X without Antenna .............................................................................. 28 15.2 Module Dimensions PAN132X with Antenna ................................................................................... 29 16 Footprint of the Module ................................................................................................................30 PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de