ENW89820AY1F

No. REV. CLASSIFICATION PRODUCT SPECIFICATION DS-17xx-2400-102 2.13 CLASS 2 BLUETOOTH LOW ENERGY SUBJECT PAGE 1 of 37 SINGLE MODE MODULE CUSTOMERS CODE PANASONICS CODE DATE 08.07.2015 PAN172x / PAN171x ENW89820AxKF / ENW89835AxKF Product Specification Applicant / Manufacturer Panasonic Industrial Devices Europe GmbH Hardware Zeppelinstrasse 19 21337 Lneburg Germany Applicant / Manufacturer Please refer to chapter 24 / 24.1 Information regarding Software Versions Software Software Version Please refer to chapter 24 / 24.1 Information regarding Software Versions By purchase of any of products described in this document the customer accepts the document s validity and declares their agreement and understanding of its contents and recommendations. Panasonic reserves the right to make changes as required without notification. APPROVED CHECKED DESIGNED Power Electronics R&D Center genehmigt geprft erstellt Wireless Connectivity Panasonic Industrial Devices Europe GmbH No. REV. CLASSIFICATION PRODUCT SPECIFICATION DS-17xx-2400-102 2.13 CLASS 2 BLUETOOTH LOW ENERGY SUBJECT PAGE 2 of 37 SINGLE MODE MODULE CUSTOMERS CODE PANASONICS CODE DATE 08.07.2015 PAN172x / PAN171x ENW89820AxKF / ENW89835AxKF TABLE OF CONTENTS 1. Scope of this Document ................................................................................................ 4 2. Difference PAN1720 / PAN1721 .................................................................................... 4 3. Difference PAN172x / PAN171x .................................................................................... 4 4. Key Features ................................................................................................................. 4 Bluetooth Low Energy ............................................................................................................ 5 5. Applications for the Module ........................................................................................... 5 6. Description for the Module ............................................................................................. 5 7. Detailed Description ...................................................................................................... 6 7.1. PAN172x Terminal Layout ................................................................................... 6 7.2. Crossreference GPIO PAN-Module to BlueRadios-Module .................................. 8 8. Bluetooth Features ........................................................................................................ 9 9. PAN172x Block Diagram ............................................................................................... 9 10. Test Conditions ........................................................................................................... 10 11. General Device Requirements and Operation ............................................................. 10 11.1. Absolute Maximum Ratings ................................................................................ 10 11.2. Recommended Operating Conditions ................................................................. 10 11.3. PAN1720 Current Consumption ......................................................................... 11 12. Bluetooth RF Performance .......................................................................................... 12 12.1. PAN1720 Bluetooth Characteristics ................................................................... 12 12.2. PAN1721 Bluetooth Characteristics ................................................................... 12 12.3. PAN17XX Spurious Emission ............................................................................. 12 13. Soldering Temperature-Time Profile (for reflow soldering) ........................................... 13 13.1. For lead solder ................................................................................................... 13 13.2. For leadfree solder ............................................................................................. 13 14. PAN172x Module Dimension ....................................................................................... 14 15. PAN171x Module Dimension ....................................................................................... 15 16. PAN172x FootPrint of the Module ............................................................................... 16 17. PAN171x FootPrint of the Module ............................................................................... 17 18. Case Marking .............................................................................................................. 18 18.1. Example for Marking .......................................................................................... 18 18.2. Marking Definition .............................................................................................. 18 19. Mechanical Requirements ........................................................................................... 18 20. Development of Applications ....................................................................................... 19 21. Reliability Tests ........................................................................................................... 19 22. Cautions ...................................................................................................................... 19 22.1. Design Notes ..................................................................................................... 19 22.2. Installation Notes ................................................................................................ 20 22.3. Usage Conditions Notes ..................................................................................... 20 22.4. Storage Notes .................................................................................................... 21 PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de