Product Information

SMUN5214DW1T1G

SMUN5214DW1T1G electronic component of ON Semiconductor

Datasheet
ON Semiconductor Bipolar Transistors - Pre-Biased SS BR XSTR NPN 50V

Manufacturer: ON Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (AUD)

191: AUD 0.1948 ( AUD 0.21 Inc GST) ea
Line Total: AUD 37.2068 ( AUD 40.93 Inc GST)

5800 - Global Stock
Ships to you between
Fri. 12 Jul to Thu. 18 Jul
MOQ: 191  Multiples: 1
Pack Size: 1
Availability Price Quantity
200790 - Global Stock


Ships to you between Fri. 12 Jul to Thu. 18 Jul

MOQ : 3000
Multiples : 3000

Stock Image

SMUN5214DW1T1G
ON Semiconductor

3000 : AUD 0.1136
9000 : AUD 0.088
24000 : AUD 0.0814
45000 : AUD 0.0772
99000 : AUD 0.075

5800 - Global Stock


Ships to you between Fri. 12 Jul to Thu. 18 Jul

MOQ : 191
Multiples : 1

Stock Image

SMUN5214DW1T1G
ON Semiconductor

191 : AUD 0.1948
250 : AUD 0.1938
500 : AUD 0.1668
1000 : AUD 0.122
3000 : AUD 0.063

     
Manufacturer
Product Category
RoHS - XON
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Notes:- Show Stocked Products With Similar Attributes.

Dual NPN Bias Resistor Transistors R1 = 10 k , R2 = 47 k NPN Transistors with Monolithic Bias Resistor Network MUN5214DW1, www.onsemi.com NSBC114YDXV6, PIN CONNECTIONS NSBC114YDP6 (3) (2) (1) This series of digital transistors is designed to replace a single device and its external resistor bias network. The Bias Resistor R Transistor (BRT) contains a single transistor with a monolithic bias 1 R 2 network consisting of two resistors a series base resistor and a Q 1 base-emitter resistor. The BRT eliminates these individual components by integrating them into a single device. The use of a BRT Q 2 can reduce both system cost and board space. R 2 R 1 Features Simplifies Circuit Design (4) (5) (6) Reduces Board Space Reduces Component Count MARKING DIAGRAMS S and NSV Prefix for Automotive and Other Applications 6 Requiring Unique Site and Control Change Requirements AEC-Q101 Qualified and PPAP Capable* 7D M SOT363 These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS CASE 419B Compliant 1 MAXIMUM RATINGS (T = 25C, common for Q and Q , unless otherwise noted) A 1 2 Rating Symbol Max Unit SOT563 7D M Collector-Base Voltage V 50 Vdc CBO CASE 463A 1 Collector-Emitter Voltage V 50 Vdc CEO Collector Current Continuous I 100 mAdc C Input Forward Voltage V 40 Vdc IN(fwd) SOT963 PM Input Reverse Voltage V 6 Vdc IN(rev) CASE 527AD 1 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 7D/P = Specific Device Code M = Date Code* ORDERING INFORMATION = Pb-Free Package Device Package Shipping (Note: Microdot may be in either location) MUN5214DW1T1G, SOT363 3,000 / Tape & Reel *Date Code orientation may vary depending up- SMUN5214DW1T1G*, on manufacturing location. NSVMUN5214DW1T2G* NSVMUN5214DW1T3G* SOT363 10,000 / Tape & Reel NSBC114YDXV6T1G SOT563 4,000 / Tape & Reel NSVBC114YDXV6T1G* NSBC114YDXV6T5G SOT563 8,000 / Tape & Reel NSBC114YDP6T5G SOT963 8,000 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Semiconductor Components Industries, LLC, 2014 1 Publication Order Number: July, 2021 Rev. 5 DTC114YD/DMUN5214DW1, NSBC114YDXV6, NSBC114YDP6 THERMAL CHARACTERISTICS Characteristic Symbol Max Unit MUN5214DW1 (SOT 363) ONE JUNCTION HEATED Total Device Dissipation P D T = 25C (Note 1) 187 mW A (Note 2) 256 Derate above 25C (Note 1) 1.5 mW/C (Note 2) 2.0 Thermal Resistance, (Note 1) R 670 C/W JA Junction to Ambient (Note 2) 490 MUN5214DW1 (SOT363) BOTH JUNCTION HEATED (Note 3) Total Device Dissipation P D T = 25C (Note 1) 250 mW A (Note 2) 385 Derate above 25C (Note 1) 2.0 mW/C (Note 2) 3.0 Thermal Resistance, R C/W JA Junction to Ambient (Note 1) 493 (Note 2) 325 Thermal Resistance, R C/W JL Junction to Lead (Note 1) 188 (Note 2) 208 Junction and Storage Temperature Range T , T 55 to +150 C J stg NSBC114YDXV6 (SOT563) ONE JUNCTION HEATED Total Device Dissipation P D T = 25C (Note 1) 357 mW A Derate above 25C (Note 1) 2.9 mW/C Thermal Resistance, R C/W JA Junction to Ambient (Note 1) 350 NSBC114YDXV6 (SOT563) BOTH JUNCTION HEATED (Note 3) Total Device Dissipation P D T = 25C (Note 1) 500 mW A Derate above 25C (Note 1) 4.0 mW/C Thermal Resistance, R C/W JA Junction to Ambient (Note 1) 250 Junction and Storage Temperature Range T , T 55 to +150 C J stg NSBC114YDP6 (SOT963) ONE JUNCTION HEATED Total Device Dissipation P D T = 25C (Note 4) 231 MW A (Note 5) 269 Derate above 25C (Note 4) 1.9 mW/C (Note 5) 2.2 Thermal Resistance, R C/W JA Junction to Ambient (Note 4) 540 (Note 5) 464 NSBC114YDP6 (SOT963) BOTH JUNCTION HEATED (Note 3) Total Device Dissipation P D T = 25C (Note 4) 339 MW A (Note 5) 408 Derate above 25C (Note 4) 2.7 mW/C (Note 5) 3.3 Thermal Resistance, R C/W JA Junction to Ambient (Note 4) 369 (Note 5) 306 Junction and Storage Temperature Range T , T 55 to +150 C J stg 1. FR4 Minimum Pad. 2. FR4 1.0 1.0 Inch Pad. 3. Both junction heated values assume total power is sum of two equally powered channels. 2 4. FR4 100 mm , 1 oz. copper traces, still air. 2 5. FR4 500 mm , 1 oz. copper traces, still air. www.onsemi.com 2

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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