Wafer-carrier Mounting Photomicrosensors EE-SPY801/802 CSM EE-SPY801 802 DS E 3 2 Photomicrosensors for detecting wafer-carrier mounting. The mounting position is set with a pedestal. The contact surface with the wafer carrier uses a special chemical- resistant fluororesin. The unique optical system enables stable detection of almost all wafer-carriers. Light modulation effectively reduces external light interference. Utilizes talc-free clean cables. For the most recent information on models that have been certified for Be sure to read Safety Precautions on safety standards, refer to your OMRON website. page 3. Ordering Information Sensors Infrared light Sensing Sensing Appearance Output configuration Cable length Model method distance EE-SPY801 2M Turns ON when wafer carrier is Reflective type 2 m 0 to 3 mm present. EE-SPY802 2M Accessories (Order Separately) Item Model EE9-C01 Pedestal EE9-C02 Note: There are no sensor functions provided. 1EE-SPY801/802 Ratings and Specifications Item Models EE- SPY801/802 2 Sensing distance 0 to 5 mm (White paper: 15 15 mm , reflection factor: 90%) 2 (Standard sensing object) 0 to 3 mm (Black paper: 15 15 mm , reflection factor: 10%) Sensing object Transparent or opaque wafer carriers Operation indicator Lit orange when object is detected. Light source GaAs infrared LED with a peak wavelength of 940 nm Supply voltage 12 to 24 VDC 10%, ripple (p-p): 5% max. Current consumption 30 mA max. NPN open collector: Load power supply voltage: 5 to 24 VDC Load current: 100 mA max. Control output OFF current: 0.5 mA max. 100 mA load current with a residual voltage of 0.8 V max. 40 mA load current with a residual voltage of 0.4 V max. Response time 5 ms max. Ambient illumination 3,000 lx max. with incandescent light or sunlight on the surface of the receiver Operating: 10 to +55C Ambient temperature range Storage: 25 to +65C (with no icing) Operating: 5% to 85% Ambient humidity range Storage: 5% to 95% (with no condensation) 2 Destruction: 1 to 500 Hz, 1.0-mm single amplitude or 150 m/s each in X, Y, and Z directions Vibration resistance 3 times and for 11 min. each 2 Shock resistance Destruction: 500 m/s for 3 times each in X, Y, and Z directions Degree of protection IEC IP30 Connecting method Pre-wired (Standard length: 2 m) Weight (packaged) Sensor: Approx. 43 g Accessory (Pedestal): Approx. 9 g Case Ethylene tetrafluoro ethylene (ETFE) Material Base plate Polybutylene phthalate (PBT) Accessories Instruction Manual I/O Circuit Diagrams Model Output configuration Timing charts Output circuit With wafer carrier Operation indicator (orange) + (Brown) Without wafer carrier ON Operation indicator OUT Load Turns ON when EE-SPY801 (orange) (Black) OFF Main wafer carrier is 12 to 24 VDC EE-SPY802 circuit ON Output present. transistor OFF (Blue) Operates Load (etc., relay) Releases 2