2SMPB-02B Datasheet Rev.16(Jun.,2017) 2SMPB-02B Digital Barometric Pressure Sensor High accuracy and small size barometric pressure sensor with low current consumption Measure barometric pressure and temperature with high accuracy Built in low noise 24bit ADC Digital control and output via IC/SPI interface Automatically power down non-working circuit to minimize power consumption Individual calibration parameters stored in OTP* (*One Time Programmable - ROM) RoHS compliant Application Example Indoor navigation (floor detection) Car navigation (to distinguish highway and frontage road) Altimeter Activity monitor (to detect up and down of stairs) Life log Weather forecast Target Devices Example Smart Phones / Tablet PCs Wearable devices, such as watch type, band type, clip type or glasses type GPS devices Healthcare devices such as pedometer Packaging Information Standard Models with Surface Mounting Terminals Structure Packaging Model Minimum Packing Unit LGA 9pin Tape and Reel 2SMPB-02B 3,500 1 Copyright 2016 OMRON Corporation. All Rights Reserved. 2SMPB-02B Datasheet Rev.16(Jun.,2017) Table of Contents 1. Ratings, Specifications and Functions ...................................................................................................... 3 1.1 Use conditions and recommended operating conditions ................................................ 3 1.2 Absolute Maximum Ratings ................................................................................................. 3 1.3 Operating Ratings ................................................................................................................. 3 1.4 Electrical Characteristics ..................................................................................................... 3 1.5 Digital Interface Characteristics .......................................................................................... 4 1.6 Characteristics by Oversampling setting (Force mode) ................................................ 4 1.7 rms Noise by IIR Filter Selection ......................................................................................... 4 1.8 Bandwidth by IIR Filter Selection ........................................................................................ 5 1.9 Filter selection based on use cases .................................................................................... 5 2. Connection .................................................................................................................................................... 6 2.1 Block Diagram ....................................................................................................................... 6 2.2 Pin Description and Layout .................................................................................................. 6 2.3 Typical Connection Diagram ................................................................................................ 7 3. Dimensions ................................................................................................................................................... 8 3.1 Package .................................................................................................................................. 8 3.2 Mounting PAD Dimensions .................................................................................................. 8 3.3 Marking structure .................................................................................................................. 8 4. Operations ..................................................................................................................................................... 9 4.1 Communication Mode ........................................................................................................... 9 4.2 Power Mode ........................................................................................................................... 9 4.3 Compensation of Pressure and Temperature .................................................................. 10 4.4 Implementing Register List ................................................................................................ 12 4.5 IC Protocol .......................................................................................................................... 15 4.6 SPI Protocol ......................................................................................................................... 16 4.7 Interface specifications ...................................................................................................... 17 4.8 Reset Function .................................................................................................................... 19 4.9 Recommended conditions of communication ................................................................. 19 5. Packaging .................................................................................................................................................... 20 5.1 Configuration of shipment ................................................................................................. 20 5.2 Taping ................................................................................................................................... 20 5.3 Reel ....................................................................................................................................... 21 5.4 Individual packaging ........................................................................................................... 21 6. Recommended Soldering Method ............................................................................................................ 22 7. Precautions ................................................................................................................................................. 22 8. Warranty and Limited Warranty ................................................................................................................ 23 2 Copyright 2016 OMRON Corporation. All Rights Reserved.