Product Information

TAP-TP1

TAP-TP1 electronic component of Ohmite

Datasheet
Thermal Pad Gray 55.90mm x 55.90mm Square

Manufacturer: Ohmite
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (AUD)

1: AUD 26.2863 ( AUD 28.91 Inc GST) ea
Line Total: AUD 26.2863 ( AUD 28.91 Inc GST)

45 - Global Stock
Ships to you between
Thu. 18 Jul to Mon. 22 Jul
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
45 - Global Stock


Ships to you between Thu. 18 Jul to Mon. 22 Jul

MOQ : 1
Multiples : 1

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TAP-TP1
Ohmite

1 : AUD 26.2863
10 : AUD 24.4101
25 : AUD 23.2398
50 : AUD 22.0694
100 : AUD 20.9176
250 : AUD 19.4315
500 : AUD 19.3014

     
Manufacturer
Product Category
Type
Material
Thermal Conductivity
Color
Thickness
Series
Packaging
Part Status
Usage
Shape
Outline
Adhesive
Backing Carrier
Thermal Resistivity
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Shelf Life Start
Storage/Refrigeration Temperature
Digi-Key Storage
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Notes:- Show Stocked Products With Similar Attributes.

Thermal Pads Thermal Interface Material for Heatsinkable devices Ohmite thermal inter face materials (TIMs) are designed for use in applications requiring reliable per formance, low contact resistance, long life, low maintenance and high thermal con- ductivity. The flexible graphite materials are die-cut to ensure exact fit and reduce module-to-module variation during assem- bly. The compressibility of the material improves sur face con- tact, reducing thermal impedance. The material compression can compensate for flatness variations of up to 125m. The high in-plane thermal conductivity of this material reduces hot spots. Ohmites high per formance TIMs are designed for long life applications with extreme heat cycles and are made of flexible graphite specifically engineered for demanding power electron- ics applications. Fea Tures aPPlica Tions Consistent, reliable thermal per formance enabling zero mainte- Power modules such as IGBT, RF devices nance applications used in: Will not low or pump out under any thermal extremes, thermal UPS and inverters cycles, power again and power cycling or part orientation Motor drives No degradation in per formance from initial install and over the Base stations / Telecommunication life of the application, reducing PM and improving MTTF Thermo Electric Devices Assembly-ready foil form factor eliminates dispensing and Power supply modules, rectifiers and cleaning processes chargers Easy installation removes the need for Burn-in or re-torque, High per formance computers and ser v- enabling a single step install ers Minimal outgassing prevents fouling of optics in lighting appli- EV / HEV / PHEV modules cations sPeciFica Tions Part No. Device type Ohmite series Typical thickness Min. Clamping Force Operating Temperature TAP-TP1 TAP TAP600, 650, 800, 2000 200mu 20 100k PA (15Pis ) -40 ~ +400C (-40 ~ +752F) TGH-TP1 OTs -227 All TGHxxx dimensions (mm) 55.9 (2.20 .015) 37.5 4.5 55.9 (2.20 TGH TAP 20 .015) 10 30.0 1-866-9-OHMITE Intl 1-847-258-0300 Fax 1-847-574-7522 www.ohmite.com info ohmite.com 21Thermal Pads Thermal Interface Material for Heatsinkable devices characTerisTics At room temperature. Properties listed are typical and cannot be used as accept/reject specifications. Max. Clamping Force 100 kPa (15 PSI) Thermal Impedance vs. Interface Pressure 700 KPA (100 PSI) Up to 0.030 mm Surface Compensation 1.2 Thermal impedance reduces sig- roughness Up to 0.1 mm flatness com- nificantly with pressure, ensuring 1.0 pensation excellent performance in pressure ranges common for most standard 0.8 700 KPA (100 PSI) 70% of starting Material Compression modules and power electronic thickness 0.6 devices per manufacturers applica- tion guide. <0.1% E595 total mass loss (TML) test Outgassing Losses 0.4 results of bare TIMs TML 0.2 Thickness Range From 0.127 to 0.51mm (varies depending 0 15 29 51 102 116 (psi) on grade) 100 200 350 700 800 (kPa) Certifications Meets RoHS certifications Flammability Pressure Rating UL94V-0 Thickness Under Compression Thermal Impedance 0.49 K-cm2/W 200 kPa (29 psi) 0.18 K-cm2/W 700 kPa (101 psi) 0.25 Material compressibility improves Typical Thermal Through-Plane: 7 W/m-K 700 kPa contact between the mating sur- 0.20 faces, adjusting for flatness and Conductivity In-Plane: 800 W/m-K 700 kPa roughness variations, ensuring reli- In-Plane conductivity at ambient tempera- 0.15 able performance. ture determined using Angstroms Method. 0.10 Thru-thickness conductivity determined 0.05 using ASTM D5470 Modified Method. Typical Starting 200m 20 (0.008 0.001) 0 15 29 51 102 116 (psi) Thickness 100 200 350 700 800 (kPa) Pressure Coefficient of Thermal Through-Thickness: 27 ppm/C Expansion In-Plane: -0.4 ppm/C Material Performance Electrical Conductivity Through-Thickness: 5 S/cm In-Plane: 19,000 S/cm When determining which grade and thickness of TIMs will Flammability Rating UL 94V-0 Compliant work for your application, the effective thermal impedance is the critical factor. The thermal impedance is the combination Operating -40 to +400C of the thermal resistance at the contact sur faces and the bulk Temperature resistance of the TIM. Specific Heat 0.80J/g-C 25C Halogen Free Yes ordering inForma Tion TGH-TP1 Product Type Thermal Material TGH = SOT-227 Pad Type TAP = TAP600, 650, 800, and 2000 rev 12/20-2 22 1-866-9-OHMITE Intl 1-847-258-0300 Fax 1-847-574-7522 www.ohmite.com info ohmite.com Total Thermal Thickness (mm) 2 Impedance (K-cm) /W

Tariff Desc

8547.9 TC 8535449 SHEETING OR SHAPES, electrically insulating, thermally conductive,
being combinations of two OR more of the following:
(a) silicone rubber;
(b) glass fibre;
(c) boron nitride;
(d) polyimide;
(e) copper
Arcol
ARCOL Ohmite
ARCOL / Ohmite
ARCOL UK Ltd
ARCOL/OHMITE
OHMITE CERAMICS RESISTOR DIV.
OHMITE MANUFACTURING
OHMITE MFG

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