NX3P1108 Logic controlled high-side power switch Rev. 2 20 June 2018 Product data sheet 1. General description The NX3P1108 is a high-side load switch which features a low ON resistance P-channel MOSFET that supports more than 1.5 A of continuous current. It has an integrated output discharge resistor to discharge the output capacitance when disabled. Designed for operation from 0.9 V to 3.6 V, it is used in power domain isolation applications to reduce power dissipation and extend battery life. The enable logic includes integrated logic level translation making the device compatible with lower voltage processors and controllers. The NX3P1108 is ideal for portable, battery operated applications due to low ground current and ultra-low OFF-state current. 2. Features and benefits Wide supply voltage range from 0.9 V to 3.6 V Very low ON resistance: 34 m at a supply voltage of 3.3 V High noise immunity Low OFF-state leakage current (2.0 A maximum) 1.2 V control logic at a supply voltage of 3.6 V High current handling capability (1.5 A continuous current) Internal output discharge resistor Turn-on slew rate limiting ESD protection: HBM JESD22-A114F Class 3A exceeds 4000 V CDM AEC-Q100-011 revision B exceeds 500 V Specified from 40 C to +85 C 3. Applications Cell phone Digital cameras and audio devices Portable and battery-powered equipmentNX3P1108 NXP Semiconductors Logic controlled high-side power switch 4. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version NX3P1108UK 40 C to +85 C WLCSP4 wafer level chip-scale package 4 bumps 0.97 SOT1376-2 mm x 0.97 mm x 0.54 mm body (backside coating included) 5. Marking Table 2. Marking codes Type number Marking code NX3P1108UK xB 6. Functional diagram 9,1 9 5 GFK / 6+,)7(9(/ (1 7 6/( 5 &(: / , 6 2 EN VIN VOUT 001aao342 DDD Fig 1. Logic symbol Fig 2. Logic diagram (simplified schematic) 7. Pinning information 7.1 Pinning EXP S 1 3 LQGH DUHD 9,1 % % *1 (1 DDD DDD Q RS YDUW W7UZVSHLDQH HZSDUWRS QQYL7UVW DH Fig 3. Pin configuration for WLCSP4 Fig 4. Ball mapping for WLCSP4 NX3P1108 All information provided in this document is subject to legal disclaimers. NXP B.V. 2018. All rights reserved. Product data sheet Rev. 2 20 June 2018 2 of 16 92 87 &+ 5*( 1 2172/5 287