BAV99/8 High-speed switching diode Rev. 01 30 March 2010 Product data sheet 1. Product profile 1.1 General description High-speed switching diode in dual series configuration, encapsulated in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package. 1.2 Features and benefits High switching speed: t 4ns Low capacitance: C 1.5 pF rr d Low leakage current Reverse voltage: V 100 V R Small SMD plastic package AEC-Q101 qualified 1.3 Applications High-speed switching Reverse polarity protection General-purpose switching 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit Per diode I reverse current V =80V - - 0.5 A R R V reverse voltage - - 100 V R 1 t reverse recovery time -- 4 ns rr 1 When switched from I =10mA to I =10 mA R = 100 measured at I =1 mA. F R L R 2. Pinning information Table 2. Pinning Pin Description Simplified outline Graphic symbol 1 anode (diode 1) 3 3 2 cathode (diode 2) 3 cathode (diode 1), anode (diode 2) 12 12 006aaa763 BAV99/8 NXP Semiconductors High-speed switching diode 3. Ordering information Table 3. Ordering information Type number Package Name Description Version BAV99/8 - plastic surface-mounted package 3 leads SOT23 4. Marking Table 4. Marking codes 1 Type number Marking code BAV99/8 MF* 1 * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Per diode V repetitive peak reverse -100 V RRM voltage V reverse voltage - 100 V R 1 I forward current -215 mA F 2 -125 mA I repetitive peak forward -500 mA FRM current 3 I non-repetitive peak square wave FSM forward current t =1 s- 4 A p t =1ms - 1 A p t =1s - 0.5 A p 1 4 P total power dissipation T 25 C -250 mW tot amb Per device T junction temperature - 150 C j T ambient temperature 65 +150 C amb T storage temperature 65 +150 C stg 1 Single diode loaded. 2 Double diode loaded. 3 T =25 C prior to surge. j 4 Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. BAV99 8 1 All information provided in this document is subject to legal disclaimers. NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 30 March 2010 2 of 11