BAT85
Schottky barrier single diode
24 July 2012 Product data sheet
1. Product profile
1.1 General description
Planar Schottky barrier diode with an integrated guard ring for stress protection,
encapsulated in a hermetically-sealed subminiature SOD68 (DO-34) package. The diode
is suitable for mounting on a 2 E (5.08 mm) pitch.
1.2 Features and benefits
Low forward voltage
Guard ring protected
Hermetically-sealed leaded glass package
1.3 Applications
Ultra high-speed switching
Voltage clamping
Protection circuits
Blocking diodes
1.4 Quick reference data
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
I average forward 0.5 ; f = 20 kHz; PCB mounting, - - 200 mA
F(AV)
current lead length = 4 mm; half sine wave
V reverse voltage - - 30 V
R
V forward voltage I = 10 mA; T = 25 C - - 400 mV
F F amb
2. Pinning information
Table 2. Pinning information
Pin Symbol Description Simplified outline Graphic symbol
1 K cathode k a K A
aaa-003679
2 A anode
DO-34 (SOD68)
Scan or click this QR code to view the latest information for this productNXP Semiconductors
BAT85
Schottky barrier single diode
3. Ordering information
Table 3. Ordering information
Type number Package
Name Description Version
BAT85 DO-34 hermetically sealed glass package; axial leaded; 2 leads SOD68
4. Marking
Table 4. Marking codes
Type number Marking code
BAT85 marking band
5. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V reverse voltage - 30 V
R
I forward current - 200 mA
F
I average forward current 0.5 ; f = 20 kHz; PCB mounting, - 200 mA
F(AV)
lead length = 4 mm; half sine wave
I repetitive peak forward current t 1 s; 0.5 - 300 mA
FRM p
I non-repetitive peak forward t 10 ms; T = 25 C - 5 A
FSM p j(init)
current
T junction temperature - 125 C
j
T ambient temperature -65 125 C
amb
T storage temperature -65 150 C
stg
6. Thermal characteristics
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R thermal resistance in free air [1] - - 320 K/W
th(j-a)
from junction to
ambient
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
BAT85 All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved
Product data sheet 24 July 2012 2 / 8