Document Number: K12P64M50SF4 Freescale Semiconductor Rev. 4, 08/2013 Data Sheet: Technical Data K12P64M50SF4 K12 Sub-Family Supports the following: MK12DX128VLH5, MK12DX256VLH5, MK12DN512VLH5 Features Security and integrity modules Operating Characteristics Hardware CRC module to support fast cyclic Voltage range: 1.71 to 3.6 V redundancy checks Flash write voltage range: 1.71 to 3.6 V 128-bit unique identification (ID) number per chip Temperature range (ambient): -40 to 105C Human-machine interface Performance General-purpose input/output Up to 50 MHz ARM Cortex-M4 core with DSP Analog modules instructions delivering 1.25 Dhrystone MIPS per 16-bit SAR ADC MHz 12-bit DAC Memories and memory interfaces Two analog comparators (CMP) containing a 6-bit Up to 512 KB of program flash for devices without DAC and programmable reference input FlexNVM. Voltage reference Up to 256 KB program flash for devices with Timers FlexNVM. Programmable delay block 64 KB FlexNVM on FlexMemory devices Eight-channel motor control/general purpose/PWM 4 KB FlexRAM on FlexMemory devices timer Up to 64 KB RAM Two 2-channel general purpose timers, one with Serial programming interface (EzPort) quadrature decoder functionality Clocks Periodic interrupt timers 3 to 32 MHz crystal oscillator 16-bit low-power timer 32 kHz crystal oscillator Carrier modulator transmitter Multi-purpose clock generator Real-time clock System peripherals Communication interfaces Multiple low-power modes to provide power USB Device Charger detect optimization based on application requirements SPI module 16-channel DMA controller, supporting up to 63 Two I2C modules request sources Four UART modules External watchdog monitor I2S module Software watchdog Low-leakage wakeup unit Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 20122013 Freescale Semiconductor, Inc.Table of Contents 1 Ordering parts...........................................................................3 5.4 Thermal specifications.......................................................20 1.1 Determining valid orderable parts......................................3 5.4.1 Thermal operating requirements...........................21 2 Part identification......................................................................3 5.4.2 Thermal attributes.................................................21 2.1 Description.........................................................................3 6 Peripheral operating requirements and behaviors....................22 2.2 Format...............................................................................3 6.1 Core modules....................................................................22 2.3 Fields.................................................................................3 6.1.1 JTAG electricals....................................................22 2.4 Example............................................................................4 6.2 System modules................................................................25 2.5 Small package marking.....................................................4 6.3 Clock modules...................................................................25 3 Terminology and guidelines......................................................5 6.3.1 MCG specifications...............................................25 3.1 Definition: Operating requirement......................................5 6.3.2 Oscillator electrical specifications.........................27 3.2 Definition: Operating behavior...........................................5 6.3.3 32 kHz oscillator electrical characteristics.............29 3.3 Definition: Attribute............................................................6 6.4 Memories and memory interfaces.....................................30 3.4 Definition: Rating...............................................................6 6.4.1 Flash electrical specifications................................30 3.5 Result of exceeding a rating..............................................7 6.4.2 EzPort switching specifications.............................33 3.6 Relationship between ratings and operating 6.5 Security and integrity modules..........................................34 requirements......................................................................7 6.6 Analog...............................................................................34 3.7 Guidelines for ratings and operating requirements............8 6.6.1 ADC electrical specifications.................................34 3.8 Definition: Typical value.....................................................8 6.6.2 CMP and 6-bit DAC electrical specifications.........38 3.9 Typical value conditions....................................................9 6.6.3 12-bit DAC electrical characteristics.....................41 4 Ratings......................................................................................9 6.6.4 Voltage reference electrical specifications............44 4.1 Thermal handling ratings...................................................9 6.7 Timers................................................................................45 4.2 Moisture handling ratings..................................................10 6.8 Communication interfaces.................................................45 4.3 ESD handling ratings.........................................................10 6.8.1 DSPI switching specifications (limited voltage 4.4 Voltage and current operating ratings...............................10 range)....................................................................45 5 General.....................................................................................10 6.8.2 DSPI switching specifications (full voltage range).47 5.1 AC electrical characteristics..............................................11 6.8.3 I2C switching specifications..................................49 5.2 Nonswitching electrical specifications...............................11 6.8.4 UART switching specifications..............................49 5.2.1 Voltage and current operating requirements.........11 6.8.5 Normal Run, Wait and Stop mode performance 5.2.2 LVD and POR operating requirements.................12 over the full operating voltage range.....................49 5.2.3 Voltage and current operating behaviors..............13 6.8.6 VLPR, VLPW, and VLPS mode performance 5.2.4 Power mode transition operating behaviors..........13 over the full operating voltage range.....................51 5.2.5 Power consumption operating behaviors..............14 7 Dimensions...............................................................................53 5.2.6 EMC radiated emissions operating behaviors.......18 7.1 Obtaining package dimensions.........................................53 5.2.7 Designing with radiated emissions in mind...........19 8 Pinout........................................................................................53 5.2.8 Capacitance attributes..........................................19 8.1 K12 Signal Multiplexing and Pin Assignments..................53 5.3 Switching specifications.....................................................19 8.2 K12 Pinouts.......................................................................56 5.3.1 Device clock specifications...................................19 9 Revision History........................................................................57 5.3.2 General switching specifications...........................20 K12 Sub-Family Data Sheet, Rev. 4, 08/2013. 2 Freescale Semiconductor, Inc.