1 (47) Data Sheet SCL3300-D01 3-axis inclinometer with angle output and digital SPI interface Features 3-axis (XYZ) inclinometer User selectable measurement modes: 3000 LSB/g with 70 Hz LPF 6000 LSB/g with 40 Hz LPF 12000 LSB/g with 10 Hz LPF Angle output resolution 0.0055/LSB 40C+125C operating range 3.0V3.6V supply voltage SPI digital interface Ultra-low 0.001 /Hz noise density Excellent offset stability Size 8.6 x 7.6 x 3.3 mm (l w h) Proven capacitive 3D-MEMS technology Applications SCL3300-D01 is targeted at applications demanding high stability and accuracy with tough environmental requirements. Typical applications include: Leveling Tilt sensing Machine control Structural health monitoring Inertial measurement units (IMUs) Robotics Positioning and guidance systems Overview The SCL3300-D01 is a high performance inclinometer sensor component. It is a three-axis inclinometer sensor with angle output based on Murata s proven capacitive 3D-MEMS technology. Signal processing is done in a mixed signal ASIC with flexible SPI digital interface. Sensor element and ASIC are packaged into 12 pin pre-molded plastic housing that guarantees reliable operation over product s lifetime. The SCL3300-D01 is designed, manufactured and tested for high stability, reliability and quality requirements. The component has extremely stable output over wide range of temperature and vibration. The component has several advanced self-diagnostics features, is suitable for SMD mounting and is compatible with RoHS and ELV directives. Murata Electronics Oy SCL3300-D01 Doc.No. 4921 www.murata.com Rev. 2 2 (47) TABLE OF CONTENTS 1 Introduction ................................................................................................................................. 4 2 Specifications ............................................................................................................................. 4 2.1 Abbreviations ......................................................................................................................... 4 2.2 General Specifications ........................................................................................................... 4 2.3 Performance Specifications for Inclinometer .......................................................................... 5 2.4 Performance Specification for Temperature Sensor ............................................................... 7 2.5 Specification for Angle Outputs .............................................................................................. 7 2.6 Absolute Maximum Ratings ................................................................................................... 8 2.7 AEC-Q100 Testing ................................................................................................................. 8 2.8 Pin Description....................................................................................................................... 9 2.9 Typical performance characteristics ..................................................................................... 10 2.10 Digital I/O Specification ........................................................................................................ 13 2.10.1 SPI DC Characteristics ................................................................................................ 13 2.10.2 SPI AC Characteristics ................................................................................................ 14 2.11 Measurement Axis and Directions........................................................................................ 15 2.11.1 Measurement Ranges on Inclination Modes ................................................................ 16 2.12 Package Characteristics ...................................................................................................... 17 2.12.1 Package Outline Drawing ............................................................................................ 17 2.13 PCB Footprint ...................................................................................................................... 18 3 General Product Description.................................................................................................... 19 3.1 Factory Calibration ............................................................................................................... 19 4 Component Operation, Reset and Power Up .......................................................................... 20 4.1 Component Operation .......................................................................................................... 20 4.2 Start-up sequence ............................................................................................................... 21 4.3 Operation modes ................................................................................................................. 22 5 Component Interfacing ............................................................................................................. 22 5.1.1 General ........................................................................................................................... 22 5.1.2 Protocol .......................................................................................................................... 23 5.1.3 SPI frame ....................................................................................................................... 24 5.1.4 Operations ...................................................................................................................... 25 5.1.5 Return Status .................................................................................................................. 26 5.2 Checksum (CRC) ................................................................................................................. 26 6 Register Definition .................................................................................................................... 27 6.1 Sensor Data Block ............................................................................................................... 29 6.1.1 Example of Acceleration Data Conversion ...................................................................... 30 6.1.2 Example of Temperature Data Conversion ..................................................................... 31 Murata Electronics Oy SCL3300-D01 Doc.No. 4921 www.murata.com Rev. 2