1 (37) Data Sheet SCA3300-D01 3-axis industrial accelerometer with digital SPI interface Features 3-axis (XYZ) accelerometer User selectable measurement modes: 1.5g, 3g , 6g with 70 Hz LPF 1.5g with 10 Hz LPF 40C+125C operating range 3.0V3.6V supply voltage SPI digital interface Extensive self-diagnostics features Ultra-low 37 g/Hz noise density Excellent offset stability Size 8.6 x 7.6 x 3.3 mm (l w h) RoHS compliant robust DFL plastic package suitable for lead free soldering process and SMD mounting Proven capacitive 3D-MEMS technology Applications SCA3300-D01 is targeted at applications demanding high stability with tough environmental requirements. Typical applications include: Leveling Angle measurement Tilt Compensation Inertial Measurement Units (IMUs) Motion analysis and control Navigation systems Overview The SCA3300-D01 is a high performance accelerometer sensor component. It is a three-axis accelerometer sensor based on Murata s proven capacitive 3D-MEMS technology. Signal processing is done in mixed signal ASIC with flexible SPI digital interface. Sensor element and ASIC are packaged into 12 pin pre-molded plastic housing that guarantees reliable operation over product s lifetime. The SCA3300-D01 is designed, manufactured and tested for high stability, reliability and quality requirements. The component has extremely stable output over wide range of temperature and vibration. The component has several advanced self-diagnostics features, is suitable for SMD mounting and is compatible with RoHS and ELV directives. Murata Electronics Oy SCA3300-D01 Doc.No. 3165 www.murata.com Rev. 2 2 (37) TABLE OF CONTENTS 1 Introduction ................................................................................................................................. 4 2 Specifications ............................................................................................................................. 4 2.1 Abbreviations ......................................................................................................................... 4 2.2 General Specifications ........................................................................................................... 4 2.3 Accelerometer Performance Specifications ............................................................................ 5 2.4 Temperature Sensor Performance Specification .................................................................... 6 2.5 Absolute Maximum Ratings ................................................................................................... 6 2.6 Pin Description....................................................................................................................... 7 2.7 Typical Performance Characteristics ...................................................................................... 8 2.8 Digital I/O Specification ........................................................................................................ 12 2.8.1 DC Characteristics .......................................................................................................... 12 2.8.2 SPI AC Characteristics ................................................................................................... 13 2.9 Measurement Axis and Directions........................................................................................ 14 2.10 Package Characteristics ...................................................................................................... 15 2.10.1 Package Outline Drawing ............................................................................................ 15 2.11 PCB Footprint ...................................................................................................................... 16 3 General Product Description.................................................................................................... 16 3.1 Factory Calibration ............................................................................................................... 17 4 Component Operation and Reset ............................................................................................ 17 4.1 Component Operation .......................................................................................................... 17 4.2 Start-up Sequence ............................................................................................................... 18 4.3 Operation Modes ................................................................................................................. 19 5 Component Interfacing ............................................................................................................. 19 5.1.1 General ........................................................................................................................... 19 5.1.2 Protocol .......................................................................................................................... 19 5.1.3 SPI Frame ...................................................................................................................... 20 5.1.4 Operations ...................................................................................................................... 21 5.1.5 Return Status .................................................................................................................. 22 5.2 Checksum (CRC) ................................................................................................................. 22 6 Register Definition .................................................................................................................... 24 6.1 Sensor Data Block ............................................................................................................... 25 6.1.1 Example of Acceleration Data Conversion ...................................................................... 25 6.1.2 Example of Temperature Data Conversion ..................................................................... 26 6.2 STO ..................................................................................................................................... 27 6.2.1 Example of Self-Test Analysis ........................................................................................ 28 6.3 STATUS .............................................................................................................................. 28 6.3.1 Example of STATUS summary reset .............................................................................. 30 Murata Electronics Oy SCA3300-D01 Doc.No. 3165 www.murata.com Rev. 2