Product Information

MX1DS10P

MX1DS10P electronic component of Microchip

Datasheet
Prescaler 15GHz Ultra Variable Broadband

Manufacturer: Microchip
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (AUD)

1: AUD 268.2685 ( AUD 295.1 Inc GST) ea
Line Total: AUD 268.2685 ( AUD 295.1 Inc GST)

15 - Global Stock
Ships to you between
Wed. 17 Jul to Fri. 19 Jul
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
15 - Global Stock


Ships to you between Wed. 17 Jul to Fri. 19 Jul

MOQ : 1
Multiples : 1

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MX1DS10P
Microchip

1 : AUD 268.2685

     
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MX1DS10P 15 GHz Ultra Variable Broadband Prescaler Application Features The MX1DS10P is ideal for phase locked Wide Operating Range: 0.05 - 15 loops and other synthesizers requiring large GHz and variable divide ratios. Other applications Variable Divide Ratios: 2 to 220 include trigger generation for high-speed Single-Ended and/or Differential measurement systems. The MX1DS10P can Drive be employed in high frequency phase locked High Input Sensitivity loops that can take advantage of the low 1/f Size: 6mm x 6mm noise of SiGe HBTs. General purpose test Single -3.3 V Power Supply instrumentation systems will also benefit from Low SSB Phase Noise: the high input sensitivity and broad frequency 153 dBc 10 kHz range. Description Pad Metallization The MX1DS10P is a broadband The QFN package pad metallization consists 0.05GHz to 15GHz prescaler with a vari- of a 300-800 micro-inch (typical thickness 435 able divide ratio between 2 and 1048576 micro-inch or 11.04um) 100% matte Sn plate. (=220). All inputs and outputs are DC The plating covers a Cu (C194) leadframe. coupled using CML logic levels. The IC The packages are manufactured with a >1hr used in this part is manufactured in an 150C annealing/heat treating process, and advanced Silicon Germanium (SiGe) the matte (non-glossy) plating, specifically process. The part requires a single 3.3V to mitigate tin whisker growth. supply and measures only 6mm x 6mm. Key Specifications (T = 25C): Vee = -3.3 V, Iee = 430 mA, Zo=50 Parameter Description Min Typ Max Clkin (GHz) Input Clock Frequency 0.05 - 15 Clkpwr (dBm) Input Clock Power Max - - 10 Clkpwr (dBm) Input Clock Power Min - -10 - Dout (Vppk) Output Voltage Swing 0.05 1 - jc (C/W) Junction-Case Thermal Resistance - 13 - Parameter Description Min Typ Max S11 (dB) Input Match (Typical) -12 -7 -5 S22 (dB) Output Match (Typical) -7 -5 -3 SMD-00028 Rev E 1 of 9 Subject to Change Without Notice MX1DS10P Frequency Divider Application Return Loss of Differential Input Ports Return Loss of Differential Output Ports Input Sensitivity Window Divide-by-2 Output (Input: 10 GHz Output: 5 GHz) Divide-by-(8/3) Output Divide-by-2048 Output (Input: 10 GHz Output: 3.75 GHz) (Input: 10 GHz Output: 4.9 MHz) SMD-00028 Rev E 2 of 9 Subject to Change Without Notice

Tariff Desc

8542.39.23 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products Free

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