PL485 Datasheet Scope This document is an overview of the main features of the PL485 microprocessor. The sole reference documents for product information on the PL485 are listed in Reference Documents. Introduction The PL485 is a fully programmable Power Line Communication (PLC) System On Chip (SOC). It is able to run any narrowband-PLC (NB-PLC) protocol in the frequency band up to 500 kHz. By means of selecting the proper firmware, the PL485 is able to support applications requiring basic connectivity (point to point, star) or complex PLC networks (mesh topologies with routing). Microchip provides firmware examples for basic PLC connectivity, as well as implementations of state-of-the-art PLC protocols such as ITU-T G.9903 (G3-PLC ) and ITU-T G.9904 (PRIME ). The PL485 is a future-proof modem able to support the evolution of the implemented NB-PLC standards. Reference Documents Type Document Title Available Ref. No. Data sheet PL360 Datasheet www.microchip.com 70005364 Data sheet SAM G55J Datasheet www.microchip.com 11289 Datasheet 60001600B-page 1 2020 Microchip Technology Inc. Table of Contents Scope............................................................................................................................................................. 1 Introduction.....................................................................................................................................................1 Reference Documents....................................................................................................................................1 1. Features..................................................................................................................................................3 2. Applications.............................................................................................................................................5 3. Block Diagram.........................................................................................................................................6 4. Chip Identifier.......................................................................................................................................... 7 5. Package and Ballout............................................................................................................................... 8 5.1. Packages......................................................................................................................................8 5.2. Ballout.......................................................................................................................................... 8 5.3. Recommended SAMG55-PL360 Connection.............................................................................10 6. Electrical Characteristics....................................................................................................................... 11 6.1. Decoupling..................................................................................................................................11 6.2. Power Sequences...................................................................................................................... 11 6.3. Thermal Characteristics..............................................................................................................11 6.4. Power Consumption................................................................................................................... 11 7. Mechanical Characteristics................................................................................................................... 12 7.1. 121-Ball TFBGA......................................................................................................................... 12 8. Recommended Mounting Conditions.................................................................................................... 16 9. Marking................................................................................................................................................. 17 10. Ordering Information............................................................................................................................. 18 11. Revision History.................................................................................................................................... 19 11.1. Rev A - 12/2019......................................................................................................................... 19 11.2. Rev B - 03/2020......................................................................................................................... 19 The Microchip Website.................................................................................................................................20 Product Change Notification Service............................................................................................................20 Customer Support........................................................................................................................................ 20 Microchip Devices Code Protection Feature................................................................................................20 Legal Notice................................................................................................................................................. 20 Trademarks.................................................................................................................................................. 21 Quality Management System....................................................................................................................... 21 Worldwide Sales and Service.......................................................................................................................22 60001600B-page 2 Datasheet 2020 Microchip Technology Inc.