Product Information

LIA-MD6000-6JMG80E

LIA-MD6000-6JMG80E electronic component of Lattice

Datasheet
FPGA - Field Programmable Gate Array AECQ Interface MIPI D-Phy Bridge

Manufacturer: Lattice
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (AUD)

1: AUD 27.8477 ( AUD 30.63 Inc GST) ea
Line Total: AUD 27.8477 ( AUD 30.63 Inc GST)

1616 - Global Stock
Ships to you between
Fri. 26 Jul to Tue. 30 Jul
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
182 - Global Stock


Ships to you between Mon. 22 Jul to Fri. 26 Jul

MOQ : 1
Multiples : 1
1 : AUD 34.6706
25 : AUD 30.8916

1616 - Global Stock


Ships to you between Fri. 26 Jul to Tue. 30 Jul

MOQ : 1
Multiples : 1
1 : AUD 27.8477
25 : AUD 25.53
100 : AUD 25.53

     
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Number of I/Os
Operating Supply Voltage
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Distributed Ram
Embedded Block Ram - Ebr
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Notes:- Show Stocked Products With Similar Attributes.

CrossLink Automotive Family Data Sheet FPGA-DS-02013 Version 1.4 July 2018 CrossLink Automotive Family Data Sheet Contents Acronyms in This Document ................................................................................................................................................. 5 1. General Description ...................................................................................................................................................... 6 1.1. Features ............................................................................................................................................................... 6 2. Product Feature Summary ............................................................................................................................................ 7 3. Architecture Overview .................................................................................................................................................. 8 3.1. MIPI D-PHY Blocks ............................................................................................................................................... 9 3.2. Programmable I/O Banks .................................................................................................................................. 13 3.3. sysI/O Buffers .................................................................................................................................................... 15 3.3.1. Programmable PULLMODE Settings ............................................................................................................. 15 3.3.2. Output Drive Strength ................................................................................................................................... 15 3.3.3. On-Chip Termination .................................................................................................................................... 15 3.4. Programmable FPGA Fabric .............................................................................................................................. 16 3.4.1. PFU Blocks ..................................................................................................................................................... 16 3.4.2. Slice ............................................................................................................................................................... 17 3.5. Clocking Structure ............................................................................................................................................. 20 3.5.1. sysCLK PLL ..................................................................................................................................................... 20 3.5.2. Primary Clocks ............................................................................................................................................... 21 3.5.3. Edge Clocks ................................................................................................................................................... 21 3.5.4. Dynamic Clock Enables ................................................................................................................................. 22 3.5.5. Internal Oscillator (OSCI) ............................................................................................................................... 22 3.6. Embedded Block RAM Overview ....................................................................................................................... 23 3.7. Power Management Unit .................................................................................................................................. 24 3.7.1. PMU State Machine ...................................................................................................................................... 24 2 3.8. User I C IP .......................................................................................................................................................... 25 3.9. Programming and Configuration ....................................................................................................................... 26 4. DC and Switching Characteristics ................................................................................................................................ 27 4.1. Absolute Maximum Ratings .............................................................................................................................. 27 4.2. Recommended Operating Conditions ............................................................................................................... 27 4.3. Power Supply Ramp Rates ................................................................................................................................. 28 4.4. Power-On-Reset Voltage Levels ........................................................................................................................ 28 4.5. ESD Performance ............................................................................................................................................... 28 4.6. DC Electrical Characteristics .............................................................................................................................. 29 4.7. CrossLink Automotive Supply Current............................................................................................................... 30 4.8. Power Management Unit (PMU) Timing ........................................................................................................... 31 4.9. sysI/O Recommended Operating Conditions .................................................................................................... 31 4.10. sysI/O Single-Ended DC Electrical Characteristics ............................................................................................. 31 4.11. sysI/O Differential Electrical Characteristics ..................................................................................................... 32 4.11.1. LVDS/subLVDS/SLVS200 ........................................................................................................................... 32 4.11.2. Hardened MIPI D-PHY I/Os ....................................................................................................................... 33 4.12. CrossLink Automotive Maximum General Purpose I/O Buffer Speed ............................................................... 34 4.13. CrossLink Automotive External Switching Characteristics ................................................................................ 35 4.14. sysCLOCK PLL Timing ......................................................................................................................................... 40 4.15. Hardened MIPI D-PHY Performance.................................................................................................................. 41 4.16. Internal Oscillators (HFOSC, LFOSC) .................................................................................................................. 41 2 1 4.17. User I C ............................................................................................................................................................. 41 4.18. CrossLink Automotive sysCONFIG Port Timing Specifications .......................................................................... 42 4.19. SRAM Configuration Time from NVCM ............................................................................................................. 42 4.20. Switching Test Conditions ................................................................................................................................. 43 5. Pinout Information ..................................................................................................................................................... 44 5.1. ctfBGA80/cktBGA80 Pinout ............................................................................................................................... 44 5.2. csfBGA81 Pinout ................................................................................................................................................ 46 5.3. Dual Function Pin Descriptions ......................................................................................................................... 48 2015-2018 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 2 FPGA-DS-02013-1.4

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
LA4
LAT
LATTICE SEMI
Lattice Semiconductor
Lattice Semiconductor Corporation
Vantis

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