Product Information

W2L13C473MAT1A

W2L13C473MAT1A electronic component of Kyocera AVX

Datasheet
Capacitor Arrays & Networks 25V X7R .047uF 0508 Tol 20%

Manufacturer: Kyocera AVX
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (AUD)

1: AUD 3.1223 ( AUD 3.43 Inc GST) ea
Line Total: AUD 3.1223 ( AUD 3.43 Inc GST)

6974 - Global Stock
Ships to you between
Fri. 26 Jul to Tue. 30 Jul
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
6870 - Global Stock


Ships to you between Fri. 26 Jul to Tue. 30 Jul

MOQ : 1
Multiples : 1

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W2L13C473MAT1A
Kyocera AVX

1 : AUD 1.9992
10 : AUD 1.495
100 : AUD 1.1712
500 : AUD 0.9607
1000 : AUD 0.8722
2000 : AUD 0.8121
4000 : AUD 0.805
8000 : AUD 0.7962
24000 : AUD 0.7802

     
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Termination Style
Capacitance
Tolerance
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IDC Low Inductance Capacitors (RoHS) IDC (InterDigitated Capacitors) 0306/0612/0508 GENERAL DESCRIPTION Inter-Digitated Capacitors (IDCs) are used for both semiconductor package and board level decoupling. The equivalent series inductance (ESL) of a single capacitor or an array of capacitors in parallel determines the response time of 0612 a Power Delivery Network (PDN). The lower the ESL of a PDN, the faster the response time. A designer can use many standard MLCCs in parallel to reduce + + ESL or a low ESL Inter-Digitated Capacitor (IDC) device. These IDC devices are available in versions with a maximum height of 0.95mm or 0.55mm. IDCs are typically used on packages of semiconductor products with power levels of 15 watts or greater. Inter-Digitated Capacitors are used on CPU, GPU, 0508 ASIC, and ASSP devices produced on 0.13, 90nm, 65nm, and 45nm processes. IDC devices are used on both ceramic and organic package substrates. These low ESL surface mount capacitors can be placed on the bottom side or the top side of a package substrate. The low profile 0.55mm maximum height IDCs can easily be used on the bottom side of BGA packages or on the die side of 0306 packages under a heat spreader. IDCs are used for board level decoupling of systems with speeds of 300MHz or greater. Low ESL IDCs free up valuable board space by reducing the number of capacitors required versus standard MLCCs. There are additional benefits to TYPICAL IMPEDANCE reducing the number of capacitors beyond saving board space including higher 10 reliability from a reduction in the number of components and lower placement costs based on the need for fewer capacitors. MLCC 1206 1 The Inter-Digitated Capacitor (IDC) technology was developed by AVX. This is LICC 0612 the second family of Low Inductance MLCC products created by AVX. IDCs are 0.1 a cost effective alternative to AVXs first generation low ESL family for high- IDC 0612 reliability applications known as LICA (Low Inductance Chip Array). 0.01 AVX IDC products are available with a lead-free finish of plated Nickel/Tin. 0.001 1 10 100 1000 Frequency (MHz) HOW TO ORDER W 3 L 1 6 D 225 M A T 3 A Capacitance Style IDC Low Number Voltage Dielectric Capacitance Failure Packaging Thickness Termination Inductance Tolerance Available Max. Thickness Case of 4 = 4V C = X7R Code (In pF) Rate T = Plated Ni A = N/A 1=7 Reel M = 20% and Sn Size Terminals 6 = 6.3V D = X5R 2 Sig. Digits + mm (in) 3=13 Reel 2 = 0508 1 = 8 Terminals Z = 10V Z = X7S Number of A=Standard 3 = 0612 Y = 16V Zeros S=0.55 (0.022) 4 = 0306 3 = 25V NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers. PERFORMANCE CHARACTERISTICS Capacitance Tolerance 20% Preferred No problems observed after 2.5 x RVDC Dissipation Factor X7R = -55C to +125C for 5 seconds at 50mA max current Operation X5R = -55C to +85C Temperature Range CTE (ppm/C) 12.0 X7S = -55C to +125C Thermal Conductivity 4-5W/M K Temperature 15% (0VDC), 22% (X7S) C oe ffi ci e nt Terminations Plated Nickel and Solder Voltage Ratings 4, 6.3, 10, 16, 25 VDC Available 6.3V = 6.5% max Dissipation Factor 10V = 5.0% max 16V = 3.5% max Insulation Resistance 100,000M min, or 1,000M per F min.,whichever is less ( +25C, RVDC) 80 Impedance (Ohms) + + IDC Low Inductance Capacitors (RoHS) IDC (InterDigitated Capacitors) 0306/0612/0508 SIZE W4 = 0306 W2 = Thin 0508 W2 = 0508 W3= Thin 0612 W3 = 0612 W3 = THICK 0612 Max. mm 0.55 0.55. 0.95 0.55 0.95 1.22 Thickness (in.) (0.022) (0.022) (0.037) (0.022) (0.037) (0.048) WVDC 4 6.3 4 6.3 10 16 25 4 6.3 10 16 25 4 6.3 10 16 4 6.3 10 16 25 4 6.3 10 16 Cap 0.010 (F) 0.022 0.033 0.047 0.068 0.10 0.22 0.33 0.47 0.68 1.0 1.5 2.2 3.3 Consult factory for PHYSICAL DIMENSIONS AND PAD LAYOUT additional requirements = X7R = X5R = X7S PAD LAYOUT DIMENSIONS PHYSICAL CHIP DIMENSIONS MILLIMETERS (INCHES) SIZE W L BW BL P SIZE A B C D E 1.60 0.20 0.82 0.10 0.25 0.10 0.20 0.10 0.40 0.05 0.38 0.89 1.27 0.20 0.40 0306 0306 (0.063 0.008) (0.032 0.006 (0.010 0.004) (0.008 0.004) (0.015 0.002) (0.015) (0.035) (0.050) (0.008) (0.015) 2.03 0.20 1.27 0.20 0.30 0.10 0.25 0.15 0.50 0.05 0.64 1.27 1.91 0.28 0.50 0508 0508 (0.080 0.008) (0.050 0.008) (0.012 0.004) (0.010 0.006) (0.020 0.002) (0.025) (0.050) (0.075) (0.011) (0.020) 3.20 0.20 1.60 0.20 0.50 0.10 0.25 0.15 0.80 0.10 0.89 1.65 2.54 0.45 0.80 0612 0612 (0.126 0.008) (0.063 0.008) (0.020 0.004) (0.010 0.006) (0.031 0.004) (0.035) (0.065) (0.010) (0.018) (0.031) 81

Tariff Desc

8532.24.00 43 no --Ceramic dielectric, multilayer Free

ELECTRICAL CAPACITORS, FIXED, VARIABLE OR ADJUSTABLE (PRE-SET)
American Technical Ceramics
American Technical Ceramics (ATC)
American Technical Ceramics (ATC) / AVX
ATC
ATC / Kyocera AVX
ATC DIVERSIFIED ELECTRONICS
AVX
AVX Kyocera
AVX (FORMERLY KNOWN AS NICHICON)
AVX / Kyocera
AVX Connectors
AVX Corp/Kyocera Corp
AVX Corporation
AVX INTERCONNECT
ELCO / AVX
Ethertronics
Ethertronics / AVX
ethertronics / kyocera avx
Ethertronics Inc
Ethertronics Inc.
ETHERTRONICS/AVX
ETHERTRONICS/KYOCERA AVX
Kyocera
kyocera avx
KYOCERA AVX Components
Kyocera Electronic Components
Kyocera Industrial Ceramics Corporation
KYOCERA INTERNATIONAL, INC.

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