ATDS3534UV395B 3.45 x 3.45 mm UV LED With Ceramic Substrate FEATURES PACKAGE DIMENSIONS High power UV-A LED Dimensions: 3.45 mm x 3.45 mm x 2.0 mm Small package with high efficiency Surface mount technology Package: 1000pcs / reel Soldering methods: IR reflow soldering Moisture sensitivity level: 1 Halogen-free RoHS compliant APPLICATIONS Photocatalytic Purification Blood and Counterfeit money detection UV curing in nail salon, dental, and poster printing applications UV Sensor Light PACKAGE MATERIALS Material as follows: Package: Ceramics Encapsulating resin: Silicone resin RECOMMENDED SOLDERING PATTERN Electrodes: Au plating (units : mm tolerance : 0.1) ATTENTION Observe precautions for handling electrostatic discharge sensitive devices Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.2(0.008 ) unless otherwise noted. 3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. SELECTION GUIDE 2 e(mW) 1 Viewing Angle 500mA*700mA Emitting Color Part Number Lens Type (Material) Code. Min. Max. Typ. 21/2 C14 640 740 800 C15 740 850 ATDS3534UV395B Ultraviolet (InGaN) Water Clear 120 C16 850 1000 - - - *1100 Notes: 1. 1/2 is the angle from optical centerline where the radiant intensity is 1/2 of the optical peak value. 2. *Radiant flux with asterisk is measured at 700mA Radiant flux: +/-15%. 3. Radiant flux value is traceable to CIE127-2007 standards. Page 1 / 7 2021 Kingbright. All Rights Reserved. Spec No: DSAP3870 / 1212100222 Rev No: V.3B Date: 03/26/2021 ATDS3534UV395B ELECTRICAL / OPTICAL CHARACTERISTICS at T =25C A Parameter Symbol Value Unit Wavelength at Peak Emission I = 500mA Min. 390 F Wavelength at Peak Emission I = 500mA Typ. 395 nm F peak Wavelength at Peak Emission I = 500mA Max. 400 F Spectral Bandwidth at 50% REL MAX I = 500mA Typ. 13 nm F Forward Voltage I = 500mA Typ. 3.4 F 1 V V F Forward Voltage I = 500mA Max. 3.9 F Allowable Reverse Current Max. I 85 mA R Temperature Coefficient of V F TC -3.0 mV/C V I = 500mA, -10C T 100C F Notes: 1. Forward voltage: 0.1V. 2. Wavelength value is traceable to CIE127-2007 standards. 3. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure. ABSOLUTE MAXIMUM RATINGS at T =25C A Parameter Symbol Value Unit Power Dissipation P 2.8 W D Reverse Voltage V 5 V R 1 Junction Temperature T 115 C j Operating Temperature T -40 to +100 C op Storage Temperature T -40 to +115 C stg 1 DC Forward Current I 700 mA F 2 Peak Forward Current I 1000 mA FM Electrostatic Discharge Threshold (HBM) 8000 V - 1 Thermal Resistance (Junction / Ambient) R 10 C/W th JA 1 Thermal Resistance (Junction / Solder point) R 5 C/W th JS Notes: 1. Results from mounting on metal core PCB, mounted on pc board-metal core PCB is recommend for lowest thermal resistance. 2. 1/10 Duty Cycle, 0.1ms Pulse Width. 3. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity Ref JEDEC/JESD625-A and JEDEC/J-STD-033. Page 2 / 7 2021 Kingbright. All Rights Reserved. Spec No: DSAP3870 / 1212100222 Rev No: V.3B Date: 03/26/2021