ca I1-I40.qxd:Layout 1 2/10/11 8:43 AM Page 1RF ca I1-I40.qxd:Layout 1 2/10/11 8:44 AM Page 37 Contacts Universal Contact is an independent SMT contact which provides Additional Advantages of using Universal Contacts an electrical connection between a device and a PCB. The contact is manufactured as a single piece stamped product, incorporating Qualification time reduction - same contact for many components pre-load and anti-lift features. The Universal Contact has been Allows standard interface across applications and platforms designed to replace traditional interfaces where the contact is Freedom to position at an angle - not fixed by mating component custom designed into the component. It can be used to connect a number of device components in any direction and configura- tion using the same interface. Applications Features & Benefits of the Design Range of heights available: Handset - 1.3mm contact with the minimum pitch of 1.35mm Solderless component interconnect - 1.8mm contact with the minimum pitch of 1.25mm I/O connector / Board to board - 2.5mm contact the minimum pitch is 1.35mm interconnect - 3.5 & 4.0mm minimum pitch is 1.45mm Battery contact / Antenna contact Solderwell that prevents solder wicking up the Grounding contact / SIM contact contact Laptops & Computers Side wings protect the active parts of the Memory Stick I contact which prevent contact from Home Electronic Devices / White Goods overstressing and potential damage Smoke detectors / Security alarm systems Domed contact point allows good hertz stress and Home appliances low contact resistance Automotive - Keyfob The X-Y-Z movement allows robust connection Medical - CT scan equipment between the contact and component assembly during shock and vibration Industrial - Circuit breaker for GPS Compliant with WEEE and RoHS directives. beckon Materials & Finishes Base material Beryllium Copper Plating Selective Au in contact area 1m min over Au stripe, 0.05 - 0.1 m over Ni 1.0 - 3.0 m Electrical Contact resistance Max 20 m Max current rating 2.0 amps nominal 3.0 amps peak Environmental Operating temperature -40C and +85C Humidity Operable in 90% relative humidity (temp + 40C) Solder systems Infrared and hot air reflow Vibration In accordance with IEC 68-2-36 Shock In accordance with IEC 68-2-27, 30 g Mechanical See selection table on the right for contact forces at specific mating heights Maximum mating cycle based on mating PCB plated with 0.05 Au over 2.0 m Ni = 3,000 cycles. (Wear resistance is subject to mating component surface finish and plating type, increased mating component plating spec = increased mating cycles.) Packaging Packaged in 12mm wide tape & reel packaging to EIA-481 standards Dimensions shown in inches (mm) www.ittcannon.com I-37