IS43/46TR16128A/AL,IS43/46TR82560A/AL 256Mx8, 128Mx16 2Gb DDR3 SDRAM ADVANCED INFORMATION DECEMBER 2011 FEATURES Standard Voltage: V and V = 1.5V 0.075V Refresh Interval: DD DDQ Low Voltage (L): V and V = 1.35V + 0.1V, -0.067V DD DDQ 7.8 us (8192 cycles/64 ms) Tc= -40C to 85C High speed data transfer rates with system 3.9 us (8192 cycles/32 ms) Tc= 85C to 105C frequency up to 933 MHz Partial Array Self Refresh 8 internal banks for concurrent operation Asynchronous RESET pin 8Bits pre-fetch architecture TDQS (Termination Data Strobe) supported (x8 Programmable CAS Latency: 5, 6, 7, 8, 9, 10 and only) 11 OCD (Off-Chip Driver Impedance Adjustment) Programmable Additive Latency: 0, CL-1,CL-2 Dynamic ODT (On-Die Termination) Programmable CAS WRITE latency (CWL) based Driver strength : RZQ/7, RZQ/6 (RZQ = 240 ) on tCK Write Leveling Programmable Burst Length: 4 and 8 Operating temperature: Programmable Burst Sequence: Sequential or Commercial (T = 0C to +95C) C Interleave Industrial (T = -40C to +95C) C BL switch on the fly Automotive, A1 (T = -40C to +95C) C Auto Self Refresh(ASR) Automotive, A2 (T = -40C to +105C) C Self Refresh Temperature(SRT) ADDRESS TABLE OPTIONS Parameter 256Mx8 128Mx16 Configuration: Row Addressing A0-A14 A0-A13 256Mx8 Column Addressing A0-A9 A0-A9 128Mx16 Bank Addressing BA0-2 BA0-2 Package: Page size 1KB 2KB 96-ball FBGA (9mm x 13mm) for x16 Auto Precharge 78-ball FBGA (9mm x 10.5mm) for x8 A10/AP A10/AP Addressing BL switch on the fly A12/BC A12/BC SPEED BIN Speed Option 187F 15H 125K 107L Units JEDEC Speed Grade DDR3-1066F DDR3-1333H DDR3-1600K DDR3-1866L CL-nRCD-nRP 7-7-7 9-9-9 11-11-11 12-12-12 tCK tRCD,tRP(min) 13.125 13.125 13.125 12.84 ns Copyright2011IntegratedSiliconSolution,Inc.Allrightsreserved.ISSIreservestherighttomakechangestothisspecificationanditsproductsatanytime withoutnotice.ISSIassumesnoliabilityarisingoutoftheapplicationoruseofanyinformation,productsorservicesdescribedherein.Customersareadvised toobtainthelatestversionofthisdevicespecificationbeforerelyingonanypublishedinformationandbeforeplacingordersforproducts. IntegratedSiliconSolution,Inc.doesnotrecommendtheuseofanyofitsproductsinlifesupportapplicationswherethefailureormalfunctionoftheproduct canreasonablybeexpectedtocausefailureofthelifesupportsystemortosignificantlyaffectitssafetyoreffectiveness.Productsarenotauthorizedforuse insuchapplicationsunlessIntegratedSiliconSolution,Inc.receiveswrittenassurancetoitssatisfaction,that: a.)theriskofinjuryordamagehasbeenminimized b.)theuserassumeallsuchrisks and c.)potentialliabilityofIntegratedSiliconSolution,Incisadequatelyprotectedunderthecircumstances Integrated Silicon Solution, Inc. www.issi.com 1 Rev. 00A 10/10/2011 IS43/46TR16128A/AL,IS43/46TR82560A/AL 1. DDR3 PACKAGE BALLOUT 1.1 DDR3 SDRAM package ballout 78-ball FBGA x8 1 2 3 4 5 6 7 8 9 A VSS VDD NC NU/TDQS VSS VDD B VSS VSSQ DQ0 DM/TDQS VSSQ VDDQ C VDDQ DQ2 DQS DQ1 DQ3 VSSQ D VSSQ DQ6 DQS VDD VSS VSSQ E VREFDQ VDDQ DQ4 DQ7 DQ5 VDDQ 1 F NC VSS RAS CK VSS NC G ODT VDD CAS CK VDD CKE H NC CS WE A10/AP ZQ NC J VSS BA0 BA2 A15 VREFCA VSS K VDD A3 A0 A12/BC BA1 VDD L VSS A5 A2 A1 A4 VSS M VDD A7 A9 A11 A6 VDD N VSS RESET A13 A14 A8 VSS Note: NC balls have no internal connection. NC/15 is one of NC pins and reserved for higher densities. Integrated Silicon Solution, Inc. www.issi.com 2 Rev. 00A 10/10/2011