Product Information

TLE5012BDE1200XUMA1

TLE5012BDE1200XUMA1 electronic component of Infineon

Datasheet
Board Mount Hall Effect / Magnetic Sensors POSITION&CURRENT SENSORS

Manufacturer: Infineon
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (AUD)

1: AUD 11.96 ( AUD 13.16 Inc GST) ea
Line Total: AUD 11.96 ( AUD 13.16 Inc GST)

4294 - Global Stock
Ships to you between
Fri. 26 Jul to Tue. 30 Jul
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
4850 - Global Stock


Ships to you between Mon. 22 Jul to Fri. 26 Jul

MOQ : 1
Multiples : 1
1 : AUD 14.73
10 : AUD 11.094
100 : AUD 9.658
500 : AUD 9.088
1000 : AUD 8.442
2500 : AUD 8.144

2136 - Global Stock


Ships to you between Mon. 22 Jul to Fri. 26 Jul

MOQ : 1
Multiples : 1
1 : AUD 15.736
10 : AUD 15.592
25 : AUD 15.45
100 : AUD 15.306
250 : AUD 15.164
500 : AUD 15.02
1000 : AUD 14.878

4294 - Global Stock


Ships to you between Fri. 26 Jul to Tue. 30 Jul

MOQ : 1
Multiples : 1
1 : AUD 11.96
10 : AUD 9.2354
100 : AUD 8.2092
500 : AUD 7.82
1000 : AUD 7.2892
2500 : AUD 7.2185

     
Manufacturer
Product Category
Type
Operating Supply Current
Maximum Output Current
Operating Point Min/Max
Operating Supply Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Mounting Style
Package / Case
Qualification
Packaging
Release Point Min/Max Brp
Hts Code
LoadingGif

Notes:- Show Stocked Products With Similar Attributes.

Angle Sensor GMR-Based Dual Die Angle Sensor TLE5012BD Data Sheet Rev. 1.2, 2017-01-13 Sense & Control TLE5012BD Revision History Page or Item Subjects Rev. 1.2, 2017-01-13 6 Changed in Rev. 1.1: Table 1-1: package version number removed 10 Changed in Rev. 1.1: Table 4-2 ESD protection modified 13 Changed in Rev. 1.1: Figure 6-2 updated with improved chip placement tolerance 15 Changed in Rev. 1.1: Table 6-2 updated with improved chip placement tolerance 17 Changed in Rev. 1.1: Figure 6-6 added with marking on frontside and backside 6 Changed in Rev. 1.2: Table 1-1 marking corrected 15 Changed in Rev. 1.2: Figure 6-3 added 15 Changed in Rev. 1.2: Table 6-2 modified 16 Changed in Rev. 1.2: Chapter 6.5: marking table corrected Trademarks of Infineon Technologies AG AURIX, C166, CanPAK, CIPOS, CIPURSE, EconoPACK, CoolMOS, CoolSET, CORECONTROL, CROSSAVE, DAVE, DI-POL, EasyPIM, EconoBRIDGE, EconoDUAL, EconoPIM, EconoPACK, EiceDRIVER, eupec, FCOS, HITFET, HybridPACK, IRF, ISOFACE, IsoPACK, MIPAQ, ModSTACK, my-d, NovalithIC, OptiMOS, ORIGA, POWERCODE PRIMARION, PrimePACK, PrimeSTACK, PRO-SIL, PROFET, RASIC, ReverSave, SatRIC, SIEGET, SINDRION, SIPMOS, SmartLEWIS, SOLID FLASH, TEMPFET, thinQ , TRENCHSTOP, TriCore. Other Trademarks Advance Design System (ADS) of Agilent Technologies, AMBA, ARM, MULTI-ICE, KEIL, PRIMECELL, REALVIEW, THUMB, Vision of ARM Limited, UK. AUTOSAR is licensed by AUTOSAR development partnership. Bluetooth of Bluetooth SIG Inc. CAT-iq of DECT Forum. COLOSSUS, FirstGPS of Trimble Navigation Ltd. EMV of EMVCo, LLC (Visa Holdings Inc.). EPCOS of Epcos AG. FLEXGO of Microsoft Corporation. FlexRay is licensed by FlexRay Consortium. HYPERTERMINAL of Hilgraeve Incorporated. IEC of Commission Electrotechnique Internationale. IrDA of Infrared Data Association Corporation. ISO of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB of MathWorks, Inc. MAXIM of Maxim Integrated Products, Inc. MICROTEC, NUCLEUS of Mentor Graphics Corporation. MIPI of MIPI Alliance, Inc. MIPS of MIPS Technologies, Inc., USA. muRata of MURATA MANUFACTURING CO., MICROWAVE OFFICE (MWO) of Applied Wave Research Inc., OmniVision of OmniVision Technologies, Inc. Openwave Openwave Systems Inc. RED HAT Red Hat, Inc. RFMD RF Micro Devices, Inc. SIRIUS of Sirius Satellite Radio Inc. SOLARIS of Sun Microsystems, Inc. SPANSION of Spansion LLC Ltd. Symbian of Symbian Software Limited. TAIYOYUDEN of Taiyo Yuden Co. TEAKLITE of CEVA, Inc. TEKTRONIX of Tektronix Inc. TOKO of TOKO KABUSHIKI KAISHA TA. UNIX of X/Open Company Limited. VERILOG, PALLADIUM of Cadence Design Systems, Inc. VLYNQ of Texas Instruments Incorporated. VXWORKS, WIND RIVER of WIND RIVER SYSTEMS, INC. ZETEX of Diodes Zetex Limited. Last Trademarks Update 2011-11-11 Data Sheet 2 Rev. 1.2, 2017-01-13

Tariff Desc

8543.70.00 - Other machines and apparatus Free
13 No Signal processors (graphic equalisers, crossovers etc.)
91 .. Other

9027.10.00 Instruments and apparatus for physical or chemical analysis (for example, polarimeters, refractometers, spectrometers, gas or smoke analysis apparatus); instruments and apparatus for measuring or checking viscosity, porosity, expansion, surface tension or the like; instruments and apparatus for measuring or checking quantities of heat, sound or light (including exposure meters); microtomes.

9031.80.00 - MEASURING OR CHECKING INSTRUMENTS, APPLIANCES AND MACHINES, NOT SPECIFIED OR INCLUDED ELSEWHERE IN THIS CHAPTER; PROFILE PROJECTORS Other instruments, appliances and machines Free
CYP
Cypress
Cypress / Spansion
CYPRESS SEMI
Cypress Semicon
Cypress Semiconductor
Cypress Semiconductor Corp
INF
INFINEON
Infineon IR
INFINEON (CYPRESS)
Infineon (IRF)
Infineon / Cypress
Infineon / IR
INFINEON TECH ICs
Infineon Technologies
INFINEON TECHNOLOGIES AG
Infineon Technologies Americas Corp.
Infinite Power Solutions
INTERNATIONAL RECTIF
INTERNATIONAL RECTIFIER
International Rectifier HiRel Products
INTL RECTIFIER
IR
IRH
Ramtron
Ramtron / Cypress Semiconductor
Ramtron International Corp
SP9
SPANSION

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