AN2019-16 CIPOS Maxi IPM IM818 Series application note About this document Scope and purpose The scope of this application note is to describe the IM818 product group of CIPOS Maxi family and the basic requirements for operating the products in a recommended mode. This is related to the integrated components, such as IGBT, diode or gate driver IC, as well as to the design of the necessary external circuitry, such as bootstrap or interfacing. Intended audience Power electronics engineers who want to design reliable and efficient CIPOS Maxi IPM applications. Table of contents About this document ....................................................................................................................... 1 Table of contents ............................................................................................................................ 1 1 Scope .................................................................................................................................... 3 1.1 Product line-up ........................................................................................................................................ 4 1.2 Nomenclature .......................................................................................................................................... 4 2 Internal components and package technology .......................................................................... 5 2.1 Power transistor technology................................................................................................................... 5 2.1.1 1200 V TRENCHSTP IGBT4 ............................................................................................................... 5 2.1.2 1200 V Emitter Controlled-Diode ....................................................................................................... 5 2.2 Control IC - 1200 V 6-channel gate driver IC ........................................................................................... 5 2.3 Thermistor ............................................................................................................................................... 5 2.4 Package technology ................................................................................................................................ 6 3 Product overview ................................................................................................................... 7 3.1 Internal circuit and features ................................................................................................................... 7 3.2 Maximum electrical ratings ..................................................................................................................... 8 3.3 Electrical characteristics ......................................................................................................................... 9 3.4 SCSOA(short-circuit safety operation area) characteristics ................................................................ 10 3.5 Description of the input and output pins ............................................................................................. 11 3.6 Outline drawing ..................................................................................................................................... 14 4 Interface circuit and layout guide ........................................................................................... 15 4.1 Input signal connection ........................................................................................................................ 15 4.2 Internal deadtime .................................................................................................................................. 16 4.3 Cross-conduction prevention circuitry ................................................................................................. 16 4.4 Advanced input filter ............................................................................................................................. 17 4.5 Matched propagation delay .................................................................................................................. 18 4.6 General interface circuit example ......................................................................................................... 19 4.7 Recommended rated output current of power supply ....................................................................... 20 4.8 Recommended layout pattern for OCP & SCP function ....................................................................... 21 4.9 Recommended wiring of shunt resistor and snubber capacitor ......................................................... 21 Application Note Please read the Important Notice and Warnings at the end of this document V 1.2 www.infineon.com page 1 of 53 2021-02-25 CIPOS Maxi IPM IM818 Series application note Scope 4.10 Pin and screw hole coordinates for IM818 footprint ............................................................................ 22 5 Protection features ............................................................................................................... 23 5.1 Under voltage protection ...................................................................................................................... 23 5.2 Overcurrent protection ......................................................................................................................... 24 5.2.1 Timing chart of overcurrent (OC) protection .................................................................................. 24 5.2.2 Selecting current sensing shunt resistor ......................................................................................... 25 5.2.3 Delay time ......................................................................................................................................... 26 5.3 RFE circuit .............................................................................................................................................. 26 5.4 Sleep function ....................................................................................................................................... 28 5.5 Temperature monitor and thermal protection .................................................................................... 29 6 Bootstrap circuit ................................................................................................................... 32 6.1 Bootstrap circuit operation .................................................................................................................. 32 6.2 Internal bootstrap functionality characteristics .................................................................................. 32 6.3 Initial charging of bootstrap capacitor ................................................................................................. 33 6.4 Bootstrap supply circuit current at switching mode ........................................................................... 34 6.5 Bootstrap circuit design ........................................................................................................................ 34 6.5.1 Bootstrap capacitor ......................................................................................................................... 34 6.5.2 Bootstrap voltage variance under inverter operating conditions ................................................. 35 7 Themral system design .......................................................................................................... 36 7.1 Introduction ........................................................................................................................................... 36 7.2 Power loss .............................................................................................................................................. 37 7.2.1 Conduction losses ............................................................................................................................ 37 7.2.2 Switching losses ............................................................................................................................... 38 7.3 Thermal impedance .............................................................................................................................. 38 7.4 Temperature rise considerations and calculation example ................................................................ 40 7.5 Heatsink selection guide ....................................................................................................................... 41 7.5.1 Required heatsink performance ...................................................................................................... 41 7.5.2 Heatsink characteristics .................................................................................................................. 41 7.5.2.1 Heat transfer from heat source to heatsink ............................................................................... 42 7.5.2.2 Heat transfer within the heatsink ............................................................................................... 42 7.5.2.3 Heat transfer from heatsink surface to ambient ....................................................................... 42 7.5.3 Selecting a heatsink ......................................................................................................................... 44 8 Heatsink mounting and hanling guidelines .............................................................................. 45 8.1 Electrical spacing .................................................................................................................................. 45 8.2 Heatsink mounting ................................................................................................................................ 46 8.2.1 General guidelines ........................................................................................................................... 46 8.2.1.1 Recommended tightening torque .............................................................................................. 46 8.2.1.2 Screw-tightening to heatsink ..................................................................................................... 48 8.2.1.3 Mounting screw ........................................................................................................................... 49 8.2.2 Recommended heatsink shape and mechanical assembly ........................................................... 49 8.3 Handling guide line ............................................................................................................................... 50 8.4 Storage guidelines ................................................................................................................................. 50 8.4.1 Recommended storage conditions ................................................................................................. 50 9 References ........................................................................................................................... 51 Revision History ............................................................................................................................ 52 Application Note 2 of 53 V 1.2 2021-02-25