Product Information

FF450R08A03P2XKSA1

FF450R08A03P2XKSA1 electronic component of Infineon

Datasheet
IGBT Modules HYBRID PACK DSC

Manufacturer: Infineon
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (AUD)

1: AUD 294.5062 ( AUD 323.96 Inc GST) ea
Line Total: AUD 294.5062 ( AUD 323.96 Inc GST)

214 - Global Stock
Ships to you between
Thu. 18 Jul to Mon. 22 Jul
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
214 - Global Stock


Ships to you between Thu. 18 Jul to Mon. 22 Jul

MOQ : 1
Multiples : 1
1 : AUD 280.6885
10 : AUD 280.6885
25 : AUD 280.6885
50 : AUD 280.6885
120 : AUD 280.6885
600 : AUD 280.6885
1080 : AUD 280.6885
2520 : AUD 280.6885

     
Manufacturer
Product Category
Product
Configuration
Collector- Emitter Voltage VCEO Max
Collector-Emitter Saturation Voltage
Continuous Collector Current at 25 C
Gate-Emitter Leakage Current
Maximum Operating Temperature
Minimum Operating Temperature
Packaging
Pd - Power Dissipation
Hts Code
LoadingGif

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Product brief HybridPACK DSC S2 High power density meets proven package Infineons new HybridPACK DSC S2 expands the HybridPACK DSC (Double Sided Cooling) Key features FF450R08A03P2 module family, of which over 3.5 Million modules are already being used today in various hybrid and plug-in hybrid vehicles since the introduction in 2017. The HybridPACK DSC Electrical family consists out of three variants of automotive qualified power modules: I 450 A c nom DSC S1 (FF400R07A01E3 S6): 705 V/400 A/Half Bridge Blocking voltage 750 V DSC S2 (FF450R08A03P2): 750 V/450 A/Half Bridge T = 150C, short-time extended vj op DSC L (FS200R07A02E3 S6): 705V/200 A/Full Bridge operation 175C On-chip Current Sensor The HybridPACK DSC S2 offers superior thermal performance and enables highest power On-chip temperature sensor density combined with short circuit ruggedness and increased blocking voltage for highest Low inductive design reliability. Additionally, it is featuring Infineons EDT2 technology for excellent light load Low switching losses power losses and superior efficiency. It targets inverter designs up to 75 kW (Infineon estimation). Mechanical Double sided cooling package Thanks to the integrated isolation the modules can be directly attached to a cooler without 2.5 kV AC 1 min insulation external isolation. The integrated on-chip current and temperature sensors allow a continu- RoHS compliant ous monitoring on chip state and thus enabling faster reaction time for die protection. Applications Key benefits FS650R08A4P2 Main inverter Hybrid and battery electric vehicles High current density enabling very Commercial, construction and agriculture vehicles compact and cost efficient inverter designs Block diagram Superior efficiency by EDT2 technology for excellent light load 1 32 power losses (20 percent improved compared to IGBT3) Highest reliability by short circuit ruggedness and increased blocking voltage Superior thermal performance Optimized for automotive applica- tions with DC link voltages up to 14 13 12 11 10 9 87 65 4 450 V and gate driver voltage level of -8 V/15 V Automotive qualified according AQG 324 www.infineon.com/DSCS2 Product brief HybridPACK DSC S2 High power density meets proven package Evaluation KIT HYBRIDPACK DSC S2 The new Evaluation Kit for HYBRIDPACK DSC S2 is based on the All-in-one: Provides complete set up with power stage, Evaluation Kit for HybridPACK DSC S1 (HybridKIT DSC), offering gate driver board and logic board an easy switch and scalability. Supports inverter designers for a faster time-to-market More details on: www.infineon.com/cms/en/product/ Enables a fast evaluation of the IGBT module evaluation-boards/kit-hybridpack-dsc-s2/ Offers a reference design Product family Type Description Characteristics OPN FF450R08A03P2 HybridPACK DSC S2 (EDT2) 750 V/450 A/Half Bridge FF450R08A03P2XKSA1 FF400R07A01E3 S6 HybridPACK DSC S1 (IGBT3) 705 V/400 A/Half Bridge FF400R07A01E3S6XKSA2 FS200R07A02E3 S6 HybridPACK DSC L (IGBT3) 705 V/200 A/Full Bridge FS200R07A02E3S6BKSA2 KIT HYBRIDPACK DSC S2 Evaluation Kit for FF450R08A03P2 including Power stage, Logic Board and Gate Driver Board KITHYBRIDPACKDSCS2TOBO1 Published by Please note Additional information Infineon Technologies AG This Document is for information purposes only and any For further information on technologies, our products, the 81726 Munich, Germany information given herein shall in no event be regarded as a application of our products, delivery terms and conditions warranty, guarantee or description of any functionality, and/or prices, please contact your nearest Infineon Technologies 2020 Infineon Technologies AG. conditions and/or quality of our products or any suitability for a office (www.infineon.com). All Rights Reserved. particular purpose. With regard to the technical specifications of our products, we kindly ask you to refer to the relevant product Warnings data sheets provided by us. Our customers and their technical Due to technical requirements, our products may contain departments are required to evaluate the suitability of our dangerous substances. For information on the types in question, products for the intended application. please contact your nearest Infineon Technologies office. We reserve the right to change this document and/or the Except as otherwise explicitly approved by us in a written information given herein at any time. document signed by authorized representatives of Infineon Technologies, our products may not be used in any life- endangering applications, including but not limited to medical, nuclear, military, life-critical or any other applications where a Document number: B136-I0819-V2-7600-EU-EC-P failure of the product or any consequences of the use thereof Date: 10 / 2020 can result in personal injury.

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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