A Product Line of Diodes Incorporated ZXGD3009DY 40V 1A GATE DRIVER IN SOT363 Description Features ZXGD3009DY is a high-speed, non-inverting single gate driver for High-Gain Buffer with Typically 500mA Output from 10mA Input switching MOSFETs. It can transfer up to 1A peak source/sink current Emitter-Follower that is Rugged to Latch-Up/Shoot-Through into the gate for effective charging and discharging of the capacitive Issues load. Wide Supply Voltage to Minimize On-Losses Separate Source and Sink Outputs for Independent Control of This gate driver ensures rapid switching of the MOSFET to minimize MOSFET Turn-On and Turn-Off Times power losses and distortion in high current switching applications. It Optimized Pin-Out to Simplify PCB Layout and Reduce can typically drive 500mA into the low gate impedance with just 10mA Parasitic Trace Inductances input from a controller. The turn-on and turn-off switching behavior of Near-Zero Quiescent Supply Current the MOSFET can be individually tailored to suit an application. In Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) particular, by defining the switching characteristics appropriately, EMI Halogen and Antimony Free. Green Device (Note 3) and cross conduction problems can be reduced. Mechanical Data Applications Power MOSFET Gate Driving in: Case: SOT363 Power Supplies Case material: Molded Plastic, Green Molding Compound. DC-DC Converters UL Flammability Rating 94V-0 Amplifier Output Stages Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Finish - Matte Tin Plated Leads. Solderable per MIL-STD-202, Method 208 Weight: 0.018 grams (Approximate) SOT363 Pin Name Pin Function V SOURCE CC V Supply Voltage High CC Not Internally IN Driver Input IN Connected V Supply Voltage Low EE SOURCE Source Current Output V SINK EE SINK Sink Current Output Top View Internal Device Top View Pin-Out Schematic Ordering Information (Note 4) Product Marking Reel size (inches) Tape width (mm) Quantity per reel ZXGD3009DYTA 3009 7 8 3,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See A Product Line of Diodes Incorporated ZXGD3009DY Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Supply Voltage, with Respect to V V 40 V EE CC 40 V Input Voltage, with Respect to VEE VIN Output Difference Voltage (Source Sink) 7 V V (source-sink) Peak Pulsed Output Current (Source and Sink) 2 A I OM Peak Pulsed Input Current 1 A I IM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Notes 5 & 7) 320 Power Dissipation P mW D (Notes 6 & 7) 277 (Notes 5 & 7) 391 Thermal Resistance, Junction to Ambient R JA (Notes 6 & 7) 450 C/W Thermal Resistance, Junction to Lead (Note 8) 350 R JL Operating and Storage Temperature Range -55 to +150 C T T J, STG ESD Ratings (Note 9) Characteristics Symbols Value Unit JEDEC Class Electrostatic Discharge Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge Machine Model ESD MM 400 V C Notes: 5. For a device mounted with pin 1 (V ) and pin 3 (V ) on 25mm x 25mm 1oz copper that is on a single-sided 1.6mm FR4 PCB device is measured CC EE under still air conditions whilst operating in steady-state. The heatsink is split in half with pin 1 (V ) and pin 3 (V ) connected separately to each half. CC EE 6. Same as Note 5, except the device is mounted on minimum recommended pad layout. 7. For device with two active die running at equal power. 8. Thermal resistance from junction to solder-point at the end of each lead on pin 1 (V ) and pin 3 (V ). CC EE 9. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 8 ZXGD3009DY November 2014 Diodes Incorporated www.diodes.com Datasheet Number: DS36913 Rev. 3 - 2