Additional Resources: Product Page 3D Model PCB Footprint date 02/13/2020 page 1 of 3 MODEL: HSS-B20-061H-03 DESCRIPTION: HEAT SINK FEATURES TO-220 package solder pin for secure PCB mounting black anodized finish aluminum 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSS-B20-061H-03 25.86 31.07 5.72 4.10 2.90 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 100 Heatsink Temperature Rise Above Without Airflow Ambient (T = Ths - Ta) (C) 90 200 LFM Power Natural 80 200 LFM 400 LFM 400 LFM (W) Conv. 70 0 0 0 0 60 1 31.07 5.72 4.10 50 2 54.97 12.61 8.99 40 3 77.04 19.56 14.04 30 4 95.24 27.21 19.43 20 5 110.74 34.70 24.50 Ths: hot spot temperature measured on the heatsink 10 Ta: ambient temperature 0 01 23 45 Heat Dissipated (W) cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model PCB Footprint CUI Devices MODEL: HSS-B20-061H-03 DESCRIPTION: HEAT SINK date 02/13/2020 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL5052 tolerance: 0.5 mm FINISH black anodized THICKNESS 0.8 mm PIN MATERIAL brass PIN PLATING tin WEIGHT 1.8 g cuidevices.com