Additional Resources: Product Page 3D Model date 06/24/2021 page 1 of 3 MODEL: HSB04-171706 DESCRIPTION: HEAT SINK FEATURES BGA design small footprint aluminum alloy black anodized finish 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSB04-171706 29.73 34.5 13.1 9.3 2.52 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 140 Without Airow 120 200 LFM Heatsink Temperature Rise Above Ambient (T = Ths - Ta) (C) 100 400 LFM Power Natural 200 LFM 400 LFM (W) Conv. 80 0 0 0 0 60 1 34.5 13.1 9.3 2 62.9 25.8 18.2 40 3 88.6 38.2 27.0 4 111.3 51.3 36.2 20 5 133.0 63.6 44.8 Ths: hot spot temperature measured on the heatsink 0 Ta: ambient temperature 0123456 Heat Dissipated (W) cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSB04-171706 DESCRIPTION: HEAT SINK date 06/24/2021 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL 6063-T5 tolerance: 0.38 mm FINISH black anodized WEIGHT 2.7 g cuidevices.com