Additional Resources: Product Page 3D Model date 06/24/2021 page 1 of 3 MODEL: HSB03-141406 DESCRIPTION: HEAT SINK FEATURES BGA design small footprint aluminum alloy black anodized finish 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSB03-141406 35.98 39.7 15.8 11.6 2.08 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 140 Without Airow 120 200 LFM Heatsink Temperature Rise Above Ambient (T = Ths - Ta) (C) 100 400 LFM Power Natural 200 LFM 400 LFM (W) Conv. 80 0 0 0 0 1 39.7 15.8 11.6 60 2 73.2 30.9 22.7 40 3 103.0 45.9 33.6 4 129.7 61.1 45.0 20 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature 0 012345 Heat Dissipated (W) cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSB03-141406 DESCRIPTION: HEAT SINK date 06/24/2021 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL 6063-T5 tolerance: 0.38 mm FINISH black anodized WEIGHT 1.6 g cuidevices.com