Additional Resources: Product Page 3D Model date 06/24/2021 page 1 of 3 MODEL: HSB01-080808 DESCRIPTION: HEAT SINK FEATURES BGA design small footprint aluminum alloy black anodized finish 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSB01-080808 39.10 43.30 16.00 11.20 1.92 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 160 140 Without Airow Heatsink Temperature Rise Above 120 Ambient (T = Ths - Ta) (C) 200 LFM Power Natural 200 LFM 400 LFM 400 LFM 100 (W) Conv. 0 0 0 0 80 1 43.3 16.0 11.2 2 79.0 30.6 21.9 60 3 112.3 43.7 32.5 40 4 136.1 57.4 43.2 Ths: hot spot temperature measured on the heatsink 20 Ta: ambient temperature 0 012345 Heat Dissipated (W) cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSB01-080808 DESCRIPTION: HEAT SINK date 06/24/2021 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL 6063-T5 tolerance: 0.38 mm FINISH black anodized WEIGHT 1.9 g cuidevices.com