Product Information

CP6055354

CP6055354 electronic component of CUI Devices

Datasheet
Thermoelectric Peltier Modules peltier 55 x 55 x 4.1 6 A wire leads arcTEC

Manufacturer: CUI Devices
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (AUD)

1: AUD 110.4584 ( AUD 121.5 Inc GST) ea
Line Total: AUD 110.4584 ( AUD 121.5 Inc GST)

116 - Global Stock
Ships to you between
Thu. 18 Jul to Mon. 22 Jul
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
76 - Global Stock


Ships to you between Thu. 18 Jul to Mon. 22 Jul

MOQ : 1
Multiples : 1

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CP6055354
CUI Devices

1 : AUD 102.7118
5 : AUD 97.6403
10 : AUD 97.5288
30 : AUD 94.9095
60 : AUD 92.3645

     
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Additional Resources: Product Page 3D Model date 11/12/2020 page 1 of 22 SERIES: CP60H DESCRIPTION: PELTIER MODULE FEATURES arcTEC structure on select models enhanced reliability for high thermal cycling superior thermal performance silicon sealed wide T max low profile precise temperature control solid state construction input input internal output output MODEL 1 2 3 4 5 voltage current resistance Qmax Tmax max max typ T =27C T =50C T =27C T =50C h h h h (Vdc) (A) (10%) (W) (W) (C) (C) CP60131H 3.8 6.0 0.45 13 14.3 70 77 CP60139H 2.1 6.0 0.30 7.4 8.2 70 77 CP60231H 8.8 6.0 1.05 29.7 32.7 70 77 CP60239H 3.8 6.0 0.55 13.6 14.9 70 77 6 CP602040395H 7.6 6.0 1.09 27.5 30.2 70 77 CP60301233H 5.6 6.0 0.76 19.7 21.7 70 77 CP60301531H 7.6 6.0 0.93 26.3 28.9 70 77 CP60302031H 13.0 6.0 1.51 49.5 54.5 68 75 6 CP603315H 15.7 6.0 1.90 53.1 59.1 70 77 6 CP6030395 11.8 6.0 1.65 41.5 45.6 70 77 6 CP603395H 8.8 6.0 1.25 31.1 34.2 70 77 6 CP604020395H 7.6 6.0 1.09 27.5 30.2 70 77 6 CP60433H 19.5 6.0 2.54 67.6 74.3 68 75 6 CP604395H 15.7 6.0 2.2 55.6 61.0 70 77 6 CP604040 24.1 6.0 3.21 83.5 91.9 68 75 6 CP60546241 41.3 6.0 5.78 147 161 70 77 6 CP6055354 35.4 6.0 4.95 126 138 70 77 6 CP60555542 29.8 6.0 4.15 106 116 70 77 6 CP604060395 23.6 6.0 3.3 80.2 88.2 70 77 Notes: 1. Maximum voltage at T max and T =27C h 2. Maximum current to achieve T max 3. Measured by AC 4-terminal method at 25C 4. Maximum heat absorbed at cold side occurs at I , V , and T=0C max max 5. Maximum temperature difference occurs at I , V , and Q=0W (T max measured in a vacuum at 1.3 Pa) max max 6. Designed with arcTEC structure. cuidevices.comAdditional Resources: Product Page 3D Model CUI Devices SERIES: CP60H DESCRIPTION: PELTIER MODULE date 11/12/2020 page 2 of 22 SPECIFICATIONS parameter conditions/description min typ max units solder melting temperature connection between thermoelectric pairs 235 C assembly compression 1 MPa RoHS yes MECHANICAL DRAWING units: mm MATERIAL PLATING ceramic plate 96% AL O 2 3 wire leads (CP60131H, CP60231H, CP60302031H 22 AWG tin CP60301233H, CP60301531H, HOT SIDE 0.05 CP603315H) wire leads (all 20 AWG tin THICKNESS other models) silicon rubber 703 RTV (between cold sealer COLD SIDE 0.05 and hot side plates) joint cover silicon rubber 703 RTV P/N & S/N printed on cold side marking surface 10.0 3.0 Red (+) WIDTH COLD SIDE Black (-) LENGTH 100.0 5.0 LENGTH WIDTH THICKNESS LENGTH WIDTH THICKNESS MODEL NO. MODEL NO. (mm) (mm) (mm) (mm) (mm) (mm) CP60131H 15 0.3 15 0.3 3.1 0.025 CP603395H 30 0.3 30 0.3 3.95 0.025 CP60139H 15 0.3 15 0.3 3.9 0.025 CP604020395H 40 0.3 20 0.3 3.95 0.025 CP60231H 20 0.3 20 0.3 3.1 0.025 CP60433H 40 0.3 40 0.3 3.3 0.03 CP60239H 20 0.3 20 0.3 3.9 0.025 CP604395H 40 0.3 40 0.3 3.95 0.025 CP602040395H 20 0.3 40 0.3 3.95 0.025 CP604040 40 0.3 40 0.3 4.0 0.1 CP60301233H 30 0.1 12 0.1 3.3 0.1 CP60546241 62.5 0.3 54 0.3 4.1 0.1 CP60301531H 30 0.3 15 0.3 3.1 0.025 CP6055354 55 0.3 55 0.3 4.1 0.1 CP60302031H 30 0.3 20 0.3 3.1 0.1 CP60555542 55 0.3 55 0.3 4.2 0.1 CP603315H 30 0.3 30 0.3 3.15 0.025 CP604060395 40 0.3 60 0.3 3.95 0.025 CP6030395 30 0.3 30 0.3 3.95 0.025 cuidevices.com

Tariff Desc

8542.31.20 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products

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