Low Noise, Precision Operational Amplifier Data Sheet OP27 FEATURES PIN CONFIGURATIONS BAL Low noise: 80 nV p-p (0.1 Hz to 10 Hz), 3 nV/Hz Low drift: 0.2 V/C V+ BAL 1 OP27 High speed: 2.8 V/s slew rate, 8 MHz gain bandwidth IN 2 OUT Low V : 10 V OS CMRR: 126 dB at VCM of 11 V NC +IN 3 High open-loop gain: 1.8 million 4V (CASE) Available in die form NC = NO CONNECT GENERAL DESCRIPTION Figure 1. 8-Lead TO-99 (J-Suffix) The OP27 precision operational amplifier combines the low 1 8 V TRIM V TRIM offset and drift of the OP07 with both high speed and low noise. OS OS OP27 IN 2 7 V+ Offsets down to 25 V and maximum drift of 0.6 V/C make +IN 3 6 OUT the OP27 ideal for precision instrumentation applications. Low 4 5 V NC noise, en = 3.5 nV/Hz, at 10 Hz, a low 1/f noise corner frequency of 2.7 Hz, and high gain (1.8 million), allow accurate NC = NO CONNECT high-gain amplification of low-level signals. A gain bandwidth Figure 2. 8-Lead CERDIP Glass Hermetic Seal (Z-Suffix), product of 8 MHz and a 2.8 V/s slew rate provide excellent 8-Lead PDIP (P-Suffix), and 8-Lead SOIC (S-Suffix) dynamic accuracy in high speed, data-acquisition systems. A low input bias current of 10 nA is achieved by use of a bias current cancellation circuit. Over the military temperature range, this circuit typically holds I and I to 20 nA and 15 nA, B OS respectively. The output stage has good load driving capability. A guaranteed swing of 10 V into 600 and low output distortion make the OP27 an excellent choice for professional audio applications. (Continued on Page 3) FUNCTIONAL BLOCK DIAGRAM V+ C2 R3 R4 1 8 Q6 Q22 Q46 C1 V ADJ.. 1 OS 1 R23 R24 R1 R2 Q21 Q23 Q24 R9 Q20 Q19 Q1A Q1B Q2B Q2A R12 OUTPUT NONINVERTING C3 C4 R5 INPUT (+) Q3 Q26 INVERTING Q45 Q11 Q12 INPUT () Q27 Q28 1 R1 AND R2 ARE PERMANENTLY ADJUSTED AT WAFER TEST FOR MINIMUM OFFSET VOLTAGE V Figure 3. Rev. 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Technical Support www.analog.com 00317-001 00317-002 00317-003OP27 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Typical Performance Characteristics ..............................................8 General Description ......................................................................... 1 Applications Information .............................................................. 14 Pin Configurations ........................................................................... 1 Offset Voltage Adjustment ........................................................ 14 Functional Block Diagram .............................................................. 1 Noise Measurements .................................................................. 14 Revision History ............................................................................... 2 Unity-Gain Buffer Applications ............................................... 14 Specifications ..................................................................................... 4 Comments On Noise ................................................................. 15 Electrical Characteristics ............................................................. 4 Audio Applications .................................................................... 16 Typical Electrical Characteristics ............................................... 6 References .................................................................................... 18 Absolute Maximum Ratings ............................................................ 7 Outline Dimensions ....................................................................... 19 Thermal Resistance ...................................................................... 7 Ordering Guide .......................................................................... 21 ESD Caution .................................................................................. 7 REVISION HISTORY 10/15Rev. G to Rev. H 1/03Rev. B to Rev. C Changes to Features Section and General Description Section ..... 1 Edits to Pin Connections .................................................................. 1 Changes to Note 1, Ordering Guide ................................................. 21 Edits to General Description ........................................................... 1 Edits to Die Characteristics .............................................................. 5 3/15Rev. F to Rev. G Edits to Absolute Maximum Ratings .............................................. 7 Changes to General Description Section ...................................... 3 Updated Outline Dimensions ....................................................... 16 Changes to Figure 31 ...................................................................... 12 Edits to Figure 8 .............................................................................. 14 Changes to Applications Information Section and Output Edits to Outline Dimensions......................................................... 16 Voltage Adjustment Section .......................................................... 14 Updated Outline Dimensions ....................................................... 19 9/01Rev. 0 to Rev. A Changes to Ordering Guide .......................................................... 21 Edits to Ordering Information ........................................................ 1 Edits to Pin Connections .................................................................. 1 5/06Rev. E to Rev. F Edits to Absolute Maximum Ratings .............................................. 2 Removed References to 745 .............................................. Universal Edits to Package Type ....................................................................... 2 Edits to Electrical Characteristics .............................................. 2, 3 Updated 741 to AD741 ...................................................... Universal Changes to Ordering Guide .......................................................... 20 Edits to Wafer Test Limits ................................................................ 4 Deleted Typical Electrical Characteristics...................................... 4 12/05Rev. D to Rev. E Edits to Burn-In Circuit Figure ....................................................... 7 Edits to Figure 2 ................................................................................ 1 Edits to Application Information .................................................... 8 9/05Rev. C to Rev. D Updated Format .................................................................. Universal Changes to Table 1 ............................................................................ 4 Removed Die Characteristics Figure ............................................. 5 Removed Wafer Test Limits Table .................................................. 5 Changes to Table 5 ............................................................................ 7 Changes to Comments on Noise Section .................................... 15 Changes to Ordering Guide .......................................................... 24 Rev. H Page 2 of 21