Product Information

MAX9972ACCS+D

MAX9972ACCS+D electronic component of Analog Devices

Datasheet
Buffers & Line Drivers Quad, Ultra-Low-Power, 300Mbps ATE Drivers/Comparators

Manufacturer: Analog Devices
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1: AUD 124.1403 ( AUD 136.55 Inc GST) ea
Line Total: AUD 124.1403 ( AUD 136.55 Inc GST)

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MOQ: 1  Multiples: 1
Pack Size: 1
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Ships to you between Fri. 26 Jul to Tue. 30 Jul

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MAX9972ACCS+D
Analog Devices

1 : AUD 117.08
10 : AUD 105.75
20 : AUD 104.0192
100 : AUD 100.5385

     
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MAX9972 Quad, Ultra-Low-Power, 300Mbps ATE Drivers/Comparators General Description Features The MAX9972 four-channel, ultra-low-power, pin-elec- 2 Small FootprintFour Channels in 0.3in tronics IC includes, for each channel, a three-level pin driver, a window comparator, a passive load, and Low-Power Dissipation: 325mW/Channel (typ) force-and-sense Kelvin-switched parametric measure- High Speed: 300Mbps at 3V P-P ment unit (PMU) connections. The driver features a -2.2V to +5.2V voltage range, includes high-impedance -2.2V to +5.2V Operating Range and active-termination (3rd-level drive) modes, and is highly linear even at low voltage swings. The window Active Termination (3rd-Level Drive) comparator features 500MHz equivalent input band- Integrated PMU Switches width and programmable output voltage levels. The passive load provides pullup and pulldown voltages to Passive Load the device-under-test (DUT). Low-Leak Mode: 20nA (max) Low-leakage, high-impedance, and terminate controls are operational configurations that are programmed Low Gain and Offset Error through a 3-wire, low-voltage, CMOS-compatible serial interface. High-speed PMU switching is realized through dedicated digital control inputs. Ordering Information This device is available in an 80-pin, 12mm x 12mm TEMP PIN- HEAT body, 0.50mm pitch TQFP with an exposed 6mm x 6mm PART RANGE PACKAGE EXTRACTION die pad on the bottom of the package for efficient heat removal. The MAX9972 is specified to operate over the 0C to MAX9972ACCS+ 80 TQFP-EP* Bottom 0C to +70C commercial temperature range, and fea- +70C tures a die temperature monitor output. +Denotes a lead(Pb)-free/RoHs-compliant package. *EP = Exposed pad. Applications NAND Flash Testers DRAM Probe Testers Low-Cost Mixed-Signal/System-on-Chip (SoC) Testers Active Burn-In Systems Pin Configuration appears at end of data sheet. Structural Testers For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maximintegrated.com. 19-0474 Rev 10 8/14MAX9972 Quad, Ultra-Low-Power, 300Mbps ATE Drivers/Comparators ABSOLUTE MAXIMUM RATINGS V to GND...........................................................-0.3V to +9.4V CHV , CLV to DUT ..................................................V to V DD SS DD V to GND..........................................................-6.25V to +0.3V DOUT to GND...........................................................-0.3V to +5V SS V to V ........................................................................+15.7V TEMP Short-Circuit Duration ......................................Continuous DD SS V to GND.................................................................-0.3V to +5V FORCE Path Switch Current..............................................50mA L DHV , DTV , DLV , LDV , DUT to GND...................V to V SENSE Path Switch Current .............................................1.5mA SS DD DATA , RCV ...........................................................-0.3V to +5V Continuous Power Dissipation (T = +70C) A CHV , CLV , CMPH , CMPL , COMPHI, 80-Pin TQFP-EP (derate 35.7mW/C above +70C) ....2857mW COMPLO to GND.....................................................V to V Storage Temperature Range .............................-65C to +150C SS DD FORCE , SENSE , PMU to GND ..............................V to V Junction Temperature......................................................+150C SS DD LD, DIN, SCLK, CS to GND......................................-0.3V to +5V Lead Temperature (soldering, 10s) .................................+300C DUT , CMPH , CMPL Short-Circuit Duration...........Continuous Soldering Temperature (reflow) .......................................+260C DHV , DLV , DTV to Each Other ..............................V to V SS DD Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (V = +8V, V = -5V, V = +3V, V = +1V, V = 0V, V = 0V, LOAD EN LOW = LOAD EN HIGH = 0, DD SS L COMPHI COMPLO LDV T = +75C. All temperature coefficients measured at T = +50C to +100C, unless otherwise noted.) (Note 1) J J PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DRIVER (all specifications apply when DUT = DHV , DUT = DTV , or DUT = DLV ) DC CHARACTERISTICS Voltage Range -2.2 +5.2 V Gain Measured at 0V and 3V 0.995 1 1.005 V/V Gain Temperature Coefficient 50 ppm/C Offset V = 2V, V = 0V, V = 1V 10 mV DHV DLV DTV Offset Temperature Coefficient 250 V/C V , V independently varied over full DD SS Power-Supply Rejection Ratio PSRR 18 mV/V range Maximum DC Drive Current I All drive mode specs valid over this range 40 mA DUT DC Output Resistance I = 10mA (Note 2) 48.5 49.5 50.5 DUT DC Output Resistance Variation I = -40mA to +40mA 2.5 DUT DHV to DLV and DTV : V = V = +1.5V, DLV DTV 5 V = -2.2V, +5.2V DHV DLV to DHV and DTV : DC Crosstalk V = V = +1.5V, 5 mV DHV DTV V = -2.2V, +5.2V DLV DTV to DHV and DLV : V = V = +1.5V, 5 DHV DLV V = -2.2V, +5.2V DTV 0 to 3V (Note 3) 5 mV Linearity Error Full range (Note 4) 15 mV 2 Maxim Integrated

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