Product Information

MAX19996AETP+

MAX19996AETP+ electronic component of Analog Devices

Datasheet
Up-Down Converters High-Gain 2GHz to 3.9GHz Downconv

Manufacturer: Analog Devices
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (AUD)

32: AUD 19.4078 ( AUD 21.35 Inc GST) ea
Line Total: AUD 621.0496 ( AUD 683.15 Inc GST)

0 - Global Stock
MOQ: 32  Multiples: 32
Pack Size: 32
Availability Price Quantity
0 - Global Stock


Ships to you between Mon. 22 Jul to Fri. 26 Jul

MOQ : 32
Multiples : 32

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MAX19996AETP+
Analog Devices

32 : AUD 19.4078
40 : AUD 18.3681
70 : AUD 18.1048
160 : AUD 17.8415
320 : AUD 17.5781
1600 : AUD 17.3148
3200 : AUD 17.0514

0 - Global Stock


Ships to you between Fri. 26 Jul to Tue. 30 Jul

MOQ : 1
Multiples : 1

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MAX19996AETP+
Analog Devices

1 : AUD 26.9
10 : AUD 25
25 : AUD 23.98
120 : AUD 20.2115
300 : AUD 19.75
540 : AUD 19.25
1020 : AUD 18.75

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Product
RF Frequency
IF Frequency
LO Frequency
Power Gain
P1dB
Operating Supply Voltage
Operating Supply Current
Maximum Power Dissipation
Maximum Operating Temperature
Mounting Style
Package / Case
P1dB - Compression Point
NF - Noise Figure
Packaging
Series
Brand
Minimum Operating Temperature
Noise Figure
Factory Pack Quantity :
Cnhts
Hts Code
Mxhts
Pd - Power Dissipation
Product Type
Subcategory
Taric
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Notes:- Show Stocked Products With Similar Attributes.

MAX19996A 19-4402 Rev 1 5/09 SiGe, High-Linearity, 2000MHz to 3900MHz Downconversion Mixer with LO Buffer General Description Features The MAX19996A single, high-linearity downconversion 2000MHz to 3900MHz RF Frequency Range mixer provides 8.7dB conversion gain, +24.5dBm IIP3, 2100MHz to 4000MHz LO Frequency Range and 9.8dB noise figure for 2000MHz to 3900MHz WCS, LTE, WiMAX, and MMDS wireless infrastructure appli- 50MHz to 500MHz IF Frequency Range cations. With an ultra-wide LO frequency range of 8.7dB Conversion Gain 2100MHz to 4000MHz, the MAX19996A can be used in either low-side or high-side LO injection architectures 9.8dB Noise Figure for virtually all 2.5GHz and 3.5GHz applications. For a +24.5dBm Typical Input IP3 2.5GHz variant tuned specifically for low-side injection, refer to the MAX19996 data sheet. 11dBm Typical Input 1dB Compression Point In addition to offering excellent linearity and noise 67dBc Typical 2LO-2RF Spurious Rejection at performance, the MAX19996A also yields a high level P = -10dBm RF of component integration. This device includes a dou- ble-balanced passive mixer core, an IF amplifier, and Integrated LO Buffer an LO buffer. On-chip baluns are also integrated to Integrated RF and LO Baluns for Single-Ended allow for single-ended RF and LO inputs. The Inputs MAX19996A requires a nominal LO drive of 0dBm, and supply current is typically 230mA at V = 5.0V, CC Low -3dBm to +3dBm LO Drive or 150mA at V = 3.3V. CC Pin Compatible with the MAX19996 2000MHz to The MAX19996A is pin compatible with the MAX19996 3000MHz Mixer 2000MHz to 3000MHz mixer. The device is also pin similar with the MAX9984/MAX9986/MAX9986A Pin Similar with the MAX9993/MAX9994/MAX9996 400MHz to 1000MHz mixers and the MAX9993/ Series of 1700MHz to 2200MHz Mixers and the MAX9994/MAX9996 1700MHz to 2200MHz mixers, MAX9984/MAX9986/MAX9986A Series of 400MHz making this entire family of downconverters ideal for to 1000MHz Mixers applications where a common PCB layout is used for Single 5.0V or 3.3V Supply multiple frequency bands. External Current-Setting Resistors Provide Option The MAX19996A is available in a compact 5mm x 5mm, 20-pin thin QFN with an exposed pad. Electrical perfor- for Operating Device in Reduced-Power/Reduced- mance is guaranteed over the extended -40C to Performance Mode +85C temperature range. Applications Ordering Information 2.3GHz WCS Base Stations PART TEMP RANGE PIN-PACKAGE MAX19996AETP+ -40C to +85C 20 Thin QFN-EP* 2.5GHz WiMAX and LTE Base Stations MAX19996AETP+T -40C to +85C 20 Thin QFN-EP* 2.7GHz MMDS Base Stations +Denotes a lead(Pb)-free/RoHS-compliant package. 3.5GHz WiMAX and LTE Base Stations *EP = Exposed pad. Fixed Broadband Wireless Access T = Tape and reel. Wireless Local Loop Private Mobile Radios Military Systems Pin Configuration/Functional Diagram appears at end of WiMAX is a trademark of WiMAX Forum. data sheet. Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com.SiGe, High-Linearity, 2000MHz to 3900MHz Downconversion Mixer with LO Buffer ABSOLUTE MAXIMUM RATINGS V to GND...........................................................-0.3V to +5.5V (Notes 1, 3)................................................................13C/W CC JC IF+, IF-, LO to GND ....................................-0.3V to (V + 0.3V) Operating Case Temperature CC RF, LO Input Power ........................................................+12dBm Range (Note 4).........................................T = -40C to +85C C RF, LO Current (RF and LO is DC shorted to GND Junction Temperature......................................................+150C through a balun)...............................................................50mA Storage Temperature Range .............................-65C to +150C Continuous Power Dissipation (Note 1) ...............................5.0W Lead Temperature (soldering, 10s) .................................+300C (Notes 2, 3)..............................................................+38C/W JA Note 1: Based on junction temperature T = T + ( x V x I ). This formula can be used when the temperature of the exposed J C JC CC CC pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction temperature must not exceed +150C. Note 2: Junction temperature T = T + ( x V x I ). This formula can be used when the ambient temperature of the PCB is J A JA CC CC known. The junction temperature must not exceed +150C. Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. Note 4: T is the temperature on the exposed pad of the package. T is the ambient temperature of the device and PCB. C A Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS (Typical Application Circuit, V = 4.75V to 5.25V, no input AC signals. T = -40C to +85C, unless otherwise noted. Typical values CC C are at V = 5.0V, T = +25C, all parameters are production tested.) CC C PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage V 4.75 5.0 5.25 V CC Supply Current I 230 245 mA CC 3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS (Typical Application Circuit, V = 3.0V to 3.6V, no input AC signals. T = -40C to +85C, unless otherwise noted. Typical values are CC C at V = 3.3V, T = +25C, parameters are guaranteed by design and not production tested, unless otherwise noted.) CC C PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage V 3.0 3.3 3.6 V CC Supply Current I Total supply current, V = 3.3V 150 mA CC CC 2 MAX19996A

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

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