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MAX19994AETX+

MAX19994AETX+ electronic component of Analog Devices

Datasheet
Up-Down Converters Dual, SiGe, High-Linearity, 1200MHz to 2000MHz Downconversion Mixer withLO Buffer/Switch

Manufacturer: Analog Devices
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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Obsolete
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0 - Global Stock

MOQ : 1
Multiples : 1

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MAX19994AETX+
Analog Devices

1 : AUD 31.1014
10 : AUD 29.0137
50 : AUD 28.1589
100 : AUD 25.463
250 : AUD 24.6904
500 : AUD 23.2767
1000 : AUD 22.4877
N/A

Obsolete
     
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RoHS - XON
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MAX19994A 19-5197 Rev 0 4/10 Dual, SiGe, High-Linearity, 1200MHz to 2000MHz Downconversion Mixer with LO Buffer/Switch General Description Features The MAX19994A dual-channel downconverter is S 1200MHz to 2000MHz RF Frequency Range designed to provide 8.4dB of conversion gain, +25dBm S 1450MHz to 2050MHz LO Frequency Range input IP3, +14dBm 1dB input compression point, and a S 50MHz to 500MHz IF Frequency Range noise figure of 9.8dB for 1200MHz to 2000MHz diversity S 8.4dB Typical Conversion Gain receiver applications. With an optimized LO frequency range of 1450MHz to 2050MHz, this mixer supports both S 9.8dB Typical Noise Figure high- and low-side LO injection architectures for the S +25dBm Typical Input IP3 1200MHz to 1700MHz and 1700MHz to 2000MHz RF S +14dBm Typical Input 1dB Compression Point bands, respectively. S 68dBc Typical 2LO - 2RF Spurious Rejection at In addition to offering excellent linearity and noise perfor- P = -10dBm mance, the device also yields a high level of component RF integration. This device includes two double-balanced S Dual Channels Ideal for Diversity Receiver passive mixer cores, two LO buffers, a dual-input LO Applications selectable switch, and a pair of differential IF output S 47dB Typical Channel-to-Channel Isolation amplifiers. Integrated on-chip baluns allow for single- S Low -6dBm to +3dBm LO Drive ended RF and LO inputs. The MAX19994A requires a nominal LO drive of 0dBm and a typical supply current of S Integrated LO Buffer 330mA at V = 5.0V, or 264mA at V = 3.3V. CC CC S Internal RF and LO Baluns for Single-Ended The MAX19994A is pin compatible with the MAX9985/ Inputs MAX9995/MAX19985A/MAX19993/MAX19995/ S Built-In SPDT LO Switch with 48dB LO-to-LO MAX19995A series of 700MHz to 2500MHz mixers Isolation and 50ns Switching Time and pin similar with the MAX19997A/MAX19999 series S Pin Compatible with the MAX9985/MAX9995/ of 1850MHz to 4000MHz mixers, making this entire MAX19985A/MAX19993/MAX19995/MAX19995A family of downconverters ideal for applications where a Series of 700MHz to 2200MHz Mixers common PCB layout is used across multiple frequency bands. S Pin Similar to the MAX19997A/MAX19999 Series of 1850MHz to 4000MHz Mixers The device is available in a 6mm x 6mm, 36-pin thin QFN package with an exposed pad. Electrical performance is S Single 5.0V or 3.3V Supply guaranteed over the extended temperature range, from S External Current-Setting Resistors Provide Option T = -40NC to +85NC. C for Operating Device in Reduced-Power/Reduced- Performance Mode Applications WCDMA/LTE Base Stations TD-SCDMA Base Stations Ordering Information GSM/EDGE Base Stations M cdma2000 Base Stations PART TEMP RANGE PIN-PACKAGE MAX19994AETX+ -40NC to +85NC 36 Thin QFN-EP* Wireless Local Loop MAX19994AETX+T -40NC to +85NC 36 Thin QFN-EP* Fixed Broadband Wireless Access +Denotes a lead(Pb)-free/RoHS-compliant package. Private Mobile Radios *EP = Exposed pad. Military Systems T = Tape and reel. cdma2000 is a registered trademark of Telecommunications Industry Association. Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com.Dual, SiGe, High-Linearity, 1200MHz to 2000MHz Downconversion Mixer with LO Buffer/Switch ABSOLUTE MAXIMUM RATINGS V to GND ..........................................................-0.3V to +5.5V B (Notes 2, 3) ..............................................................7.4NC/W CC JC LO1, LO2 to GND .................................................-0.3V to +0.3V Operating Case Temperature LOSEL to GND .........................................-0.3V to (V + 0.3V) Range (Note 4) ................................................. -40NC to +85NC CC RFMAIN, RFDIV, and LO Input Power ........................+15dBm Junction Temperature .....................................................+150NC RFMAIN, RFDIV Current Storage Temperature Range ............................ -65NC to +150NC (RF is DC shorted to GND through a balun) ...................50mA Lead Temperature (soldering, 10s) ................................+300NC Continuous Power Dissipation (Note 1) ..............................8.7W Soldering Temperature (reflow) ......................................+260NC B (Notes 1, 3) ............................................................ +38NC/W JA Note 1: Junction temperature T = T + (B x V x I ). This formula can be used when the ambient temperature of the PCB is J A JA CC CC known. The junction temperature must not exceed +150NC. Note 2: Based on junction temperature T = T + (B x V x I ). This formula can be used when the temperature of the J C JC CC CC exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction temperature must not exceed +150NC. Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. Note 4: T is the temperature on the exposed pad of the package. T is the ambient temperature of the device and PCB. C A Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS (Typical Application Circuit, V = 4.75V to 5.25V, no input AC signals. T = -40NC to +85NC, R1 = R4 = 681I, R2 = R5 = 1.82kI. CC C Typical values are at V = 5.0V, T = +25NC, unless otherwise noted. All parameters are production tested.) CC C PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage V 4.75 5 5.25 V CC Supply Current I Total supply current 330 420 mA CC LOSEL Input High Voltage V 2 V IH LOSEL Input Low Voltage V 0.8 V IL LOSEL Input Current I I -10 +10 FA IH and IL 3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS (Typical Application Circuit, V = 3.0V to 3.6V, no input AC signals. T = -40NC to +85NC, R1 = R4 = 681I, R2 = R5 = 1.43kI. CC C Typical values are at V = 3.3V, T = +25NC, unless otherwise noted.) CC C PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage V 3.0 3.3 3.6 V CC Supply Current I Total supply current 264 mA CC LOSEL Input High Voltage V 2 V IH LOSEL Input Low Voltage V 0.8 V IL RECOMMENDED AC OPERATING CONDITIONS PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS C1 = C8 = 39pF (Note 5) 1200 1700 RF Frequency f MHz RF C1 = C8 = 1.8pF, L7 = L8 = 4.7nH (Note 5) 1700 2000 LO Frequency f (Note 5) 1450 2050 MHz LO 2 MAX19994A

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8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

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